Home > Search Results: keywords:"surface insulation resistance"
Search:
Search Tips :: Advanced Search
Search collections:
Sort by: Display results: Output format:
National Repository of Grey Literature 3 records found  Search took 0.00 seconds. 
Electrochemical Migration of Flux Residues and Sirface Insulation Resistance Changes
 Hájka, Jan ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This thesis deals with electrochemical migration on printed circuit boards induced by flux residues. In the theoretical part of the thesis, the theory related to electromigration is discussed and the mechanisms of each type are described. The theory of fluxes is elaborated, focusing on the VOC-free fluxes Pacific 2009 mlf and Kester 979 T. In the practical part, the fabrication of test PCBs is described and the reproducibility of the fabrication process is observed. Furthermore, a methodology for testing the effect of flux residues on the surface insulation resistance according to the relevant standard is proposed. The proposed methodology is applied to compare the above mentioned fluxes and surface treatments.
Detailed record
Flux Residues after Reflow Soldering
 Uhlář, Vít ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The aim of this bachelor thesis is to solve flux residue characteristics on PCBś after reflow soldering and compare different solder pastes. The first part deals with the issue of solder paste application and flux residues. The second part focuses on the process of reflow soldering. The third part is devoted to the measurement methodology of flux residues. Finally, project is a practical part, which is summarized in the production of test samples and contains measurement results.
Detailed record
Flux Residues after Reflow Soldering
 Uhlář, Vít ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The aim of this bachelor thesis is to solve flux residue characteristics on PCBś after reflow soldering and compare different solder pastes. The first part deals with the issue of solder paste application and flux residues. The second part focuses on the process of reflow soldering. The third part is devoted to the measurement methodology of flux residues. Finally, project is a practical part, which is summarized in the production of test samples and contains measurement results.
Detailed record

Interested in being notified about new results for this query?
Subscribe to the RSS feed.
Digital Repository :: Search :: Submit :: Personalize :: Help
Powered by Invenio v1.1.2
Maintained by admin.invenio@techlib.cz
This site is also available in the following languages:
Česky  English