|
|
Solder Joint Reliability and Wetting Characteristics Influence
Labaj, Radek ; Stejskal, Petr (referee) ; Starý, Jiří (advisor)
This thesis deals with the methodology of testing the wetting characteristics for different material and process effects in the double-plated base material. Testing is performed by wetting balance method. There is designed procedure to calculate the angles on each side of the non-homogeneous material. The Design of Experiments method is used to interpret the results, by using this method are also interpreted electrical and mechanical properties of solder joints. The correlation with wetting characteristics is discussed.
|
|
|
Optimization of electrochemical sensor for detection in microvolume
Gajdoš, Libor ; Pekárek, Jan (referee) ; Prášek, Jan (advisor)
This thesis describes optimization and modification of standard thick-film electrochemical sensor to be able to be used for detection in microvolumes. In the theoretical part, the thick film technology is described. The work is then focused on the wettability of surfaces followed by introduction to electrochemistry and electro-analytical methods. In the experimental part, screen-printing of various types of thick film pastes on ceramic substrates for determination of their wettability and the following modification of the sensors with thick-film paste and with Parylene vaporization can be found, as well as the basic electrochemical measurements in microvolume using the modified sensor. Finally the results are summarized in conclusion.
|
|
|
Monitoring of Solder Spreading Velocity on Metal Surface
Růžička, Miroslav ; Dušek,, Karel (referee) ; Starý, Jiří (advisor)
This work deals with flushing monitoring of spreading velocity on solder finishes Niau, OSP, Sn deposited on copper plated base material FR4 using digital cameras. After the reflow process is measured by length of spreading solder and size of wetting angle. It evaluates and compares the time dependence of velocity of spreading solder, length of solder spreading and wetting angle for NiAu, OSP, Sn finishes at different temperatures reflow and surface treatment.
|
|
|
Wetting and Spreading of Solder on PCB Surface
Wiesner, Lukáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work deals with the metal surface wetting problems of molten lead-free solder and monitoring of ongoing processes at the inter-phase interface. This work also deals with flushing monitoring of spreading velocity on solder finishes Ni/Au and Immersion Sn deposited on copper plated base material FR4 using digital cameras. Measurement is performed at the improved workplace. After the reflow process is measured by length of spreading solder. It evaluates and compares the time dependence of velocity of spreading solder for Ni/Au and Immersion Sn finishes.
|
|
|
Visual comparison of lead-free connections for different material combinations
Šula, Matěj ; Starý, Jiří (referee) ; Schnederle, Petr (advisor)
Bachelors thesis describes problems soldering process. It summarizes the knowledge from soldering process, lead-free alloys and solder joint visual testing. The paper compares the influence of protective nitrogen atmosphere to the visual properties of lead-free solders for different base materials. It focuses mainly on assessment of the quality of solder joints in accordance with global standards IPC-A-610.The work includes the recommendations of material combinations.
|
|
|
Wetting and Spreading of Liquid Solder on Metal Surface
Kučera, Lukáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work deals with the metal surface wetting problems of molten lead-free solder and monitoring of ongoing processes at the inter-phase interface using the method of evaluation of the height of the molten solder deducted from the video sequences. The work is aimed at evaluating the metal surface wettability, wetting angle determined. Wettability of the metal surface is compared for different types of surface treatments and for different ages of the measured samples. Measurement is performed at the improved workplace, is used to evaluate the newly derived formula for calculating the wetting angle and created program for automatic evaluation of Picture is used to.
|
|
|
Wetting and Spreading of Solder on PCB Surface
Wiesner, Lukáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work deals with the metal surface wetting problems of molten lead-free solder and monitoring of ongoing processes at the inter-phase interface. This work also deals with flushing monitoring of spreading velocity on solder finishes Ni/Au and Immersion Sn deposited on copper plated base material FR4 using digital cameras. Measurement is performed at the improved workplace. After the reflow process is measured by length of spreading solder. It evaluates and compares the time dependence of velocity of spreading solder for Ni/Au and Immersion Sn finishes.
|
|
|
Visual comparison of lead-free connections for different material combinations
Šula, Matěj ; Starý, Jiří (referee) ; Schnederle, Petr (advisor)
Bachelors thesis describes problems soldering process. It summarizes the knowledge from soldering process, lead-free alloys and solder joint visual testing. The paper compares the influence of protective nitrogen atmosphere to the visual properties of lead-free solders for different base materials. It focuses mainly on assessment of the quality of solder joints in accordance with global standards IPC-A-610.The work includes the recommendations of material combinations.
|
|
|
Optimization of electrochemical sensor for detection in microvolume
Gajdoš, Libor ; Pekárek, Jan (referee) ; Prášek, Jan (advisor)
This thesis describes optimization and modification of standard thick-film electrochemical sensor to be able to be used for detection in microvolumes. In the theoretical part, the thick film technology is described. The work is then focused on the wettability of surfaces followed by introduction to electrochemistry and electro-analytical methods. In the experimental part, screen-printing of various types of thick film pastes on ceramic substrates for determination of their wettability and the following modification of the sensors with thick-film paste and with Parylene vaporization can be found, as well as the basic electrochemical measurements in microvolume using the modified sensor. Finally the results are summarized in conclusion.
|
|
|
Monitoring of Solder Spreading Velocity on Metal Surface
Růžička, Miroslav ; Dušek,, Karel (referee) ; Starý, Jiří (advisor)
This work deals with flushing monitoring of spreading velocity on solder finishes Niau, OSP, Sn deposited on copper plated base material FR4 using digital cameras. After the reflow process is measured by length of spreading solder and size of wetting angle. It evaluates and compares the time dependence of velocity of spreading solder, length of solder spreading and wetting angle for NiAu, OSP, Sn finishes at different temperatures reflow and surface treatment.
|
guest ::
