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Thermal bridge, condensation of water vapor and the risk of mold growth
 Kalousek, Miloš
Thermal bridge occurs in envelope structures and is undesirable in terms of signs inside the building. If the construction is not sufficient internal surface temperature begins to surface water vapor condensation and mold growth under the given boundary conditions, ie temperature and relative humidity of indoor air. How can I prevent this phenomenon within the project and construction or in the proposal to follow up. Examples will be given by thermovision method diagnostic, modeling of temperature field and the elimination of thermal bridges.
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