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Virtual laboratory modul development
Volf, Lukáš ; Novotný, Marek (referee) ; Vaško, Cyril (advisor)
Virtual laboratory is project aimed at creation of modern teaching instrument, which should help to students of microelectronics, but not only them, to understand questions of surface mount technology and packaging in electrotechnics. This work deals with analysis one of substantial part of the project, which is creation of interactive animations helping to understand questions of a given problems. In this work are described partial technological processes and their sequential application into interactive multimedia format.
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Optimalization of CMOS Chip Interconnection Process for Higher Current Load
Novotný, Marek ; Mach,, Pavel (referee) ; Hulenyi,, Ladislav (referee) ; Szendiuch, Ivan (advisor)
This work deals with silicon chip interconnection with a view to high current up to 10A. A wire bonding method is used for interconnection. The first part of investigation is focused on the modeling and simulation by the help of program ANSYS. Thermo mechanical stressing and current density is important parts of this research. Stress and current density distribution are results of the first part. The experimental part describes transition resistance, electro migration and thermal process in the connection of wire and chip pad. A controlled current source (0 – 10A) is used for measurement. The current source makes it possible to 4-point method measurement with sampling rate 1,5MHz.
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Optimalization of CMOS Chip Interconnection Process for Higher Current Load
Novotný, Marek ; Mach,, Pavel (referee) ; Hulenyi,, Ladislav (referee) ; Szendiuch, Ivan (advisor)
This work deals with silicon chip interconnection with a view to high current up to 10A. A wire bonding method is used for interconnection. The first part of investigation is focused on the modeling and simulation by the help of program ANSYS. Thermo mechanical stressing and current density is important parts of this research. Stress and current density distribution are results of the first part. The experimental part describes transition resistance, electro migration and thermal process in the connection of wire and chip pad. A controlled current source (0 – 10A) is used for measurement. The current source makes it possible to 4-point method measurement with sampling rate 1,5MHz.
|
|
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Virtual laboratory modul development
Volf, Lukáš ; Novotný, Marek (referee) ; Vaško, Cyril (advisor)
Virtual laboratory is project aimed at creation of modern teaching instrument, which should help to students of microelectronics, but not only them, to understand questions of surface mount technology and packaging in electrotechnics. This work deals with analysis one of substantial part of the project, which is creation of interactive animations helping to understand questions of a given problems. In this work are described partial technological processes and their sequential application into interactive multimedia format.
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