Home > Search Results: keywords:"izotermické stárnutí"
Search:
Search Tips :: Advanced Search
Search collections:
Sort by: Display results: Output format:
National Repository of Grey Literature 2 records found  Search took 0.01 seconds. 
Research of reliability of solder ball terminals on BGA packages attached by innovative method
 Gregor, Adam ; Jankovský, Jaroslav (referee) ; Otáhal, Alexandr (advisor)
This master´s thesis deals with the investigation of the reliability and service life of solder bumps on BGA packages created using new method using directly heated stencil. The methodology of reliability tests using isothermal and cyclic thermal aging of solder ball terminals was proposed. Test samples of BGA packages were created using this new method of reflow solder bumps and then was statistically evaluated. The internal structure and crystallographic orientation of the planes were investigated.
Detailed record
Research of reliability of solder ball terminals on BGA packages attached by innovative method
 Gregor, Adam ; Jankovský, Jaroslav (referee) ; Otáhal, Alexandr (advisor)
This master´s thesis deals with the investigation of the reliability and service life of solder bumps on BGA packages created using new method using directly heated stencil. The methodology of reliability tests using isothermal and cyclic thermal aging of solder ball terminals was proposed. Test samples of BGA packages were created using this new method of reflow solder bumps and then was statistically evaluated. The internal structure and crystallographic orientation of the planes were investigated.
Detailed record

Interested in being notified about new results for this query?
Subscribe to the RSS feed.
Digital Repository :: Search :: Submit :: Personalize :: Help
Powered by Invenio v1.1.2
Maintained by admin.invenio@techlib.cz
This site is also available in the following languages:
Česky  English