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Solder Joint Quality based on Heating Factor
Kučírek, Martin ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Master’s thesis in the theoretical part analyses the heating factor (Q), which has significant share on quality of a solder joint. The practical part describes the design and production of test PCB and setting temperature profiles, SMD resistors soldering by using BiSn solder paste. Shear tests of SMD solder joints were realised and evaluated including isothermal ageing samples. At the end of master’s thesis solder joints visual aspects and defects were evaluated, measurement thickness of intermetallic compound by not only optical microscope but also SEM, discussion about results and Q was evaluated.
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Study of the influence of alloying elements on the solubility of titanium in magnesium
Staněk, Jan ; Buchtík, Martin (referee) ; Březina, Matěj (advisor)
This master’s thesis deals with the study of the influence of aluminium and zinc on the solubility of titanium in magnesium. The theoretical part summarizes the basic knowledge about magnesium and magnesium alloys with a focus on systems containing aluminium, zinc and titanium. It also describes powder metallurgy technology, specifically the preparation, compaction and sintering of metal powders. The theoretical part ends with literature review on the current research of ternary and quaternary magnesium alloys. The experimental part focuses on the preparation of magnesium materials alloyed with titanium, zinc and aluminium by powder metallurgy and the basic structural and mechanical characterisation of the prepared materials. The effect of alloying elements and temperature on the solubility of titanium particles in magnesium was investigated. It was found that the main condition for the dissolution of titanium in magnesium is the temperature of 800 °C and the presence of aluminium, which initiates the reaction by forming intermetallic compounds with titanium. After incorporation of titanium into the material structure, new intermetallic compounds were formed with all elements not previously described in the literature, in addition to the structures described.
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Solder Joint Quality based on Heating Factor
Kučírek, Martin ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Master’s thesis in the theoretical part analyses the heating factor (Q), which has significant share on quality of a solder joint. The practical part describes the design and production of test PCB and setting temperature profiles, SMD resistors soldering by using BiSn solder paste. Shear tests of SMD solder joints were realised and evaluated including isothermal ageing samples. At the end of master’s thesis solder joints visual aspects and defects were evaluated, measurement thickness of intermetallic compound by not only optical microscope but also SEM, discussion about results and Q was evaluated.
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