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Optimization of the printed circuit board for power LED
Schenk, David ; Klíma, Martin (referee) ; Ing. Josef Vochyán, Ph.D., ALCZ Jihlava (advisor)
This diploma thesis deals with the problems of heat transfer on printed circuit boards. The first part consists of a theoretical analysis of the principles of conduction of heat in different environments, comparing the properties of common type’s base materials for PCBs in terms of thermal properties and focuses on heat transfer from the chip. In the following part they are general information about the program ANSYS ® Workbench ™. Next part consists of the basic designs of PCBs and their improving. PCBs thermal properties for different configurations are verified with calculations, simulations and practical measurements. In the last part there are created design recommendations for PCBs design based on the comparison of the results of initial proposals and proposals to improvements.
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Immersion Tin Surface Finish of PCB
Karzel, Vítězslav ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The aim of this work is to study and more deeply understand everything about surface finishing of the printed circuit boards, that are used for lead-free soldering. Mainly we should focus on immersion tin and prepare some fundamental information for future measurement. Therefore, in the first part of the thesis is our main task is to create a~sufficient theoretical background for printed circuit boards, immersion tin and solderability. Then we are able to use previously created theoretical background to measure selected samples. Thereafter the measured data can be used for more strict evaluation, from which the results of measurement can be obtained.
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Production logistics of printed circuits desks
Susko, Petr ; Starý, Jiří (referee) ; Špinka, Jiří (advisor)
This thesis describes the design of a new plant for the production of printed circuit boards with a capacity of 40,000 square meters per year. Describes the basic principles of a new production, production logistics principles and technological design, procedure for application of the method SLP, placement of production areas and capacity calculation of employees and machines. It also describes the technological process of production of printed circuit boards with subtractive method and discusses the different steps of production with regard to the proposed production. The practical part deals with the actual realization of the project, a selection of production technology, machinery, design the layout of the building, capacity calculations, deployment tools, practical application of the method SLP, visualization of production in the Plavis VisTable software, waste management and economic evaluation of project costs.
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Verify the possibility of plasma treatment of printed circuit boards for subsequent surface treatment
Brokeš, Josef ; Košelová, Zuzana (referee) ; Otáhal, Alexandr (advisor)
This thesis deals with the regeneration and cleaning of printed circuit boards with emphasis on the use of plasma technology. Various surface cleaning methods, including manual cleaning, industrial washing and plasma treatment, were investigated and their effect on the subsequent quality of the paintwork. A systematic analysis of the effect of plasma treatment on the paint quality and functionality of the plates is also carried out, including an investigation of the possibility of regenerating older plates. This study provides a basis for further research and development in this area. The thesis also presents the design and implementation of a prototype plasma developer device for integration into a production line.
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Immersion Tin Surface Finish of PCB
Karzel, Vítězslav ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The aim of this work is to study and more deeply understand everything about surface finishing of the printed circuit boards, that are used for lead-free soldering. Mainly we should focus on immersion tin and prepare some fundamental information for future measurement. Therefore, in the first part of the thesis is our main task is to create a~sufficient theoretical background for printed circuit boards, immersion tin and solderability. Then we are able to use previously created theoretical background to measure selected samples. Thereafter the measured data can be used for more strict evaluation, from which the results of measurement can be obtained.
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|
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Production logistics of printed circuits desks
Susko, Petr ; Starý, Jiří (referee) ; Špinka, Jiří (advisor)
This thesis describes the design of a new plant for the production of printed circuit boards with a capacity of 40,000 square meters per year. Describes the basic principles of a new production, production logistics principles and technological design, procedure for application of the method SLP, placement of production areas and capacity calculation of employees and machines. It also describes the technological process of production of printed circuit boards with subtractive method and discusses the different steps of production with regard to the proposed production. The practical part deals with the actual realization of the project, a selection of production technology, machinery, design the layout of the building, capacity calculations, deployment tools, practical application of the method SLP, visualization of production in the Plavis VisTable software, waste management and economic evaluation of project costs.
|
|
|
Optimization of the printed circuit board for power LED
Schenk, David ; Klíma, Martin (referee) ; Ing. Josef Vochyán, Ph.D., ALCZ Jihlava (advisor)
This diploma thesis deals with the problems of heat transfer on printed circuit boards. The first part consists of a theoretical analysis of the principles of conduction of heat in different environments, comparing the properties of common type’s base materials for PCBs in terms of thermal properties and focuses on heat transfer from the chip. In the following part they are general information about the program ANSYS ® Workbench ™. Next part consists of the basic designs of PCBs and their improving. PCBs thermal properties for different configurations are verified with calculations, simulations and practical measurements. In the last part there are created design recommendations for PCBs design based on the comparison of the results of initial proposals and proposals to improvements.
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