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Research of the Quality of Solder Joints by BGA and QFN Packages
Otáhal, Alexandr ; Adámek, Martin (referee) ; Szendiuch, Ivan (advisor)
This diplomas thesis deals with specific technologies and manufacture of BGA and QFN packages. Also summarizes the most used test methods for assessing the reliability for. Describes the making of equipment for soldering in a nitrogen atmosphere, followed by comparison solder joints of BGA and QFN forming in different atmosphere. Finally, summarizes knowledge about the process of soldering and desoldering lead-free solders for BGA packages, followed by experimental evaluation of the causes of malfunction of repaired samples.
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Analysis of Defects on PCB Using X-RAY
Mlýnek, Martin ; Vala, Radek (referee) ; Řihák, Pavel (advisor)
This thesis is focused on BGA packages and fault detection after rework using X – Ray. There is a description of BGA packages by carrier substrate, techniques of connecting on chip, from mounting packages to repair printed circuit boards (hereafter PCB). Thesis summarizes description of defects, which are created after rework process. There is also description of X – Ray as method for analyzing defects. X – PLANE method used to detect internal structure of BGA packages and it was confirmed by microsection and by software for reconstruction. Description of automatic and manual measurement is follow.
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Analysis of Defects on PCB Using X-RAY
Mlýnek, Martin ; Vala, Radek (referee) ; Řihák, Pavel (advisor)
This thesis is focused on BGA packages and fault detection after rework using X – Ray. There is a description of BGA packages by carrier substrate, techniques of connecting on chip, from mounting packages to repair printed circuit boards (hereafter PCB). Thesis summarizes description of defects, which are created after rework process. There is also description of X – Ray as method for analyzing defects. X – PLANE method used to detect internal structure of BGA packages and it was confirmed by microsection and by software for reconstruction. Description of automatic and manual measurement is follow.
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Research of the Quality of Solder Joints by BGA and QFN Packages
Otáhal, Alexandr ; Adámek, Martin (referee) ; Szendiuch, Ivan (advisor)
This diplomas thesis deals with specific technologies and manufacture of BGA and QFN packages. Also summarizes the most used test methods for assessing the reliability for. Describes the making of equipment for soldering in a nitrogen atmosphere, followed by comparison solder joints of BGA and QFN forming in different atmosphere. Finally, summarizes knowledge about the process of soldering and desoldering lead-free solders for BGA packages, followed by experimental evaluation of the causes of malfunction of repaired samples.
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