|
|
Precise setup of production process to minimalize presence of voids in solder joints where were used alloy SAC305
Slavík, Pavel ; Macho, Tomáš (referee) ; Valach, Soběslav (advisor)
The theoretical part of dissertation is devoted to familiarization with the process of assembly and soldering of PCBs. There are described the selected types of lead-free solder paste, the various procedures of flux deposition, where the greater part is focuses to the printing through template. Also, I analyze the different procedures shouldering and soldering. I focused mainly on the mechanical mounting of SMD components soldering with help convection reflow and soldering in the vapor. In the practical part is described the design of the test PCB, methodology of assembly PCB and soldering various technologies with predefined settings. The analysis of the results is done by a non-destructive x-ray method and destructive micro-cut method. The x-ray method detects the position and size of the voids in the solder. This information is used for faster processing of micro-cut. The micro-cut method is included in the analysis for a more detailed examination of the solder joint. At the end of the thesis, there is a summary of the recommendation that the setting of the manufacturing process increases the quality of the brazed joint.
|
|
|
Comparison of solders for power modules
Spaček, Marek ; Boušek, Jaroslav (referee) ; Hejátková, Edita (advisor)
Táto práca podáva náhľad na výkonové polovodičové moduly, technológie v nich požívané a niektoré procesy používané na ich výrobu. Popisuje aj niektoré kvalitatívne kritériá pre spájkovaný spoj medzi DBC substrátom modulu a jeho základovou doskou a metódy používané na ich inšpekciu. Na koniec porovnáva vlastnosti 6-zložkovej vysoko spoľahlivostnej spájky 90iSC vyvinutej firmou Henkel so štandardnou spájkou požívanou na výrobu modulov vo firme SEMIKRON pri použitím rôznych spájkovacích programov, použitím röntgenovej inšpekcie, SAM a metalurgických rezov.
|
|
|
Laser diode soldering
Straka, Michal ; Holík, Milan (referee) ; Stejskal, Petr (advisor)
This work deals with the laser diode soldering. The theoretical part summarizes general and acquired findings about soldering technology and materials that occur in this process. It also describes factors that affect the reliability of solder joints. It is closely focused to the shaping of the solder joint and structure of intermetallic layer. The practical part of this work is focused on the design of equipment for laser diode soldering and subsequent shaping of the samples. The quality of soldered joint is compared against the quality of joint created using re-flow technology - remelting in in-line smelter. The structure and thickness of the intermetallic layer, the number and shape of the voids in the solder joints are compared.
|
|
|
Rework and Repair Procedures of Selected Components and LED on Various Types of PCBs.
Pospíšil, Tomáš ; Ondřej, Klemš (referee) ; Starý, Jiří (advisor)
This work deals with technology of rework and repairs of electronic soldering assemblies. The work is primarily focused on the rework and repairs of electronic soldering assemblies with the light emitting diode. The theoretical part describes the technological methods of soldering and reworking of electronic assemblies, their diagnostics, evaluation of their influence on reliability and functional properties. The practical part is focused on the real application of technological procedures of rework and repairs, their testing and evaluation. Furthermore there is described and tested the influence of thermal load during soldering on the properties of light emitting diodes.
|
|
|
Reliability of lead free solder joint
Paško, Martin ; Knotek, Tomáš (referee) ; Stejskal, Petr (advisor)
This thesis deals with voids formation in lead-free soldered joint. In theoretical part are described types of voids, voids formation, effect on join reliability, effect reflow profile on voids formation and effect of surface finish on voids formation. In practical part is investigated a effect of thermal stress on voids growth.
|
|
|
Precise setup of production process to minimalize presence of voids in solder joints where were used alloy SAC305
Slavík, Pavel ; Macho, Tomáš (referee) ; Valach, Soběslav (advisor)
The theoretical part of dissertation is devoted to familiarization with the process of assembly and soldering of PCBs. There are described the selected types of lead-free solder paste, the various procedures of flux deposition, where the greater part is focuses to the printing through template. Also, I analyze the different procedures shouldering and soldering. I focused mainly on the mechanical mounting of SMD components soldering with help convection reflow and soldering in the vapor. In the practical part is described the design of the test PCB, methodology of assembly PCB and soldering various technologies with predefined settings. The analysis of the results is done by a non-destructive x-ray method and destructive micro-cut method. The x-ray method detects the position and size of the voids in the solder. This information is used for faster processing of micro-cut. The micro-cut method is included in the analysis for a more detailed examination of the solder joint. At the end of the thesis, there is a summary of the recommendation that the setting of the manufacturing process increases the quality of the brazed joint.
|
|
|
Rework and Repair Procedures of Selected Components and LED on Various Types of PCBs.
Pospíšil, Tomáš ; Ondřej, Klemš (referee) ; Starý, Jiří (advisor)
This work deals with technology of rework and repairs of electronic soldering assemblies. The work is primarily focused on the rework and repairs of electronic soldering assemblies with the light emitting diode. The theoretical part describes the technological methods of soldering and reworking of electronic assemblies, their diagnostics, evaluation of their influence on reliability and functional properties. The practical part is focused on the real application of technological procedures of rework and repairs, their testing and evaluation. Furthermore there is described and tested the influence of thermal load during soldering on the properties of light emitting diodes.
|
|
|
Comparison of solders for power modules
Spaček, Marek ; Boušek, Jaroslav (referee) ; Hejátková, Edita (advisor)
Táto práca podáva náhľad na výkonové polovodičové moduly, technológie v nich požívané a niektoré procesy používané na ich výrobu. Popisuje aj niektoré kvalitatívne kritériá pre spájkovaný spoj medzi DBC substrátom modulu a jeho základovou doskou a metódy používané na ich inšpekciu. Na koniec porovnáva vlastnosti 6-zložkovej vysoko spoľahlivostnej spájky 90iSC vyvinutej firmou Henkel so štandardnou spájkou požívanou na výrobu modulov vo firme SEMIKRON pri použitím rôznych spájkovacích programov, použitím röntgenovej inšpekcie, SAM a metalurgických rezov.
|
|
|
Reliability of lead free solder joint
Paško, Martin ; Knotek, Tomáš (referee) ; Stejskal, Petr (advisor)
This thesis deals with voids formation in lead-free soldered joint. In theoretical part are described types of voids, voids formation, effect on join reliability, effect reflow profile on voids formation and effect of surface finish on voids formation. In practical part is investigated a effect of thermal stress on voids growth.
|
|
|
Laser diode soldering
Straka, Michal ; Holík, Milan (referee) ; Stejskal, Petr (advisor)
This work deals with the laser diode soldering. The theoretical part summarizes general and acquired findings about soldering technology and materials that occur in this process. It also describes factors that affect the reliability of solder joints. It is closely focused to the shaping of the solder joint and structure of intermetallic layer. The practical part of this work is focused on the design of equipment for laser diode soldering and subsequent shaping of the samples. The quality of soldered joint is compared against the quality of joint created using re-flow technology - remelting in in-line smelter. The structure and thickness of the intermetallic layer, the number and shape of the voids in the solder joints are compared.
|
guest ::
