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PCBs Repairs with BGA and FC Packages
Buřival, Tomáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Graduation thesis is specialized on dilemma of the integrated circuits with ball grid array. Chapter two describes several types of packages and confrontation of their characteristics. Chapter three considers possibilities of corrections these boards bedded with packages, mounting and demounting of these packages, method of camera control and also inspection of the soldering process. Chapter four attend to practical measuring of thermal profiles and their optimalization.
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Virtual laboratory modul development
Volf, Lukáš ; Novotný, Marek (referee) ; Vaško, Cyril (advisor)
Virtual laboratory is project aimed at creation of modern teaching instrument, which should help to students of microelectronics, but not only them, to understand questions of surface mount technology and packaging in electrotechnics. This work deals with analysis one of substantial part of the project, which is creation of interactive animations helping to understand questions of a given problems. In this work are described partial technological processes and their sequential application into interactive multimedia format.
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Non conventional applications of HIC´s
Grund, Pavel ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
Within the frame of this bachelor’s thesis was carried out given circuit, a capacitive probe. Topology was created during the semester project. The realized hybrid integrated circuit combines two technologies – thick film technology and surface mount technology using SMD components. The bachelor’s thesis is divided on the theoretical part, which contains a description of the theoretical design and production of hybrid integrated circuit, also owns a design capacitive probe in hybrid form with a selection of components and calculates the size of the substrate thick film resistors, and a practical part. The practical part is described in detail the production of our HIC, including verification of functionality.
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Problems in Solder Paste Stencil Printing for Fine Pitch Components
Šimeček, Ondřej ; Polsterová, Helena (referee) ; Starý, Jiří (advisor)
Despote the indisputable advantages of fine-pitch components, is need to calculate with a few trouble during production, especially increased requirements for accuracy of mounting and solder printing. In this work I’m concerned with problems of solder printing for these components and evaluation using SPC. For the evaluation I used 3D paste inspection based on laser scanning of the surface. The output of this work is to describe the principles of solder printing and elaborating of GR&R, SPC analysis and histograms of solder printing for some outputs. I focused in my master thesis on motive design change of problematic components and economic evaluation of the adjustments.
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Complex Production Line for Through Hole and Surface Mount Components Assembly from energy saving point of view
Tomanček, Maroš ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
Thesis deals with analysis of electronic assembly line from an energy consumption point of perspective. The throughput rate is observed along with consumption of individual devices from the chosen assembly line at Resideo company. The work load balance of the assembly line was evaluated by cycle time analysation. Electrical power and losses were measured with the use of power logger and a thermal camera. The possible energy saving solutions are then concluded from analysis and comparison of power drawn by the devices. Use of low temperature solder alloys and other modern industry solutions were considered with recommendation to be used in the field.
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Non conventional applications of HIC´s
Grund, Pavel ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
Within the frame of this bachelor’s thesis was carried out given circuit, a capacitive probe. Topology was created during the semester project. The realized hybrid integrated circuit combines two technologies – thick film technology and surface mount technology using SMD components. The bachelor’s thesis is divided on the theoretical part, which contains a description of the theoretical design and production of hybrid integrated circuit, also owns a design capacitive probe in hybrid form with a selection of components and calculates the size of the substrate thick film resistors, and a practical part. The practical part is described in detail the production of our HIC, including verification of functionality.
|
|
|
Problems in Solder Paste Stencil Printing for Fine Pitch Components
Šimeček, Ondřej ; Polsterová, Helena (referee) ; Starý, Jiří (advisor)
Despote the indisputable advantages of fine-pitch components, is need to calculate with a few trouble during production, especially increased requirements for accuracy of mounting and solder printing. In this work I’m concerned with problems of solder printing for these components and evaluation using SPC. For the evaluation I used 3D paste inspection based on laser scanning of the surface. The output of this work is to describe the principles of solder printing and elaborating of GR&R, SPC analysis and histograms of solder printing for some outputs. I focused in my master thesis on motive design change of problematic components and economic evaluation of the adjustments.
|
|
|
Virtual laboratory modul development
Volf, Lukáš ; Novotný, Marek (referee) ; Vaško, Cyril (advisor)
Virtual laboratory is project aimed at creation of modern teaching instrument, which should help to students of microelectronics, but not only them, to understand questions of surface mount technology and packaging in electrotechnics. This work deals with analysis one of substantial part of the project, which is creation of interactive animations helping to understand questions of a given problems. In this work are described partial technological processes and their sequential application into interactive multimedia format.
|
|
|
PCBs Repairs with BGA and FC Packages
Buřival, Tomáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Graduation thesis is specialized on dilemma of the integrated circuits with ball grid array. Chapter two describes several types of packages and confrontation of their characteristics. Chapter three considers possibilities of corrections these boards bedded with packages, mounting and demounting of these packages, method of camera control and also inspection of the soldering process. Chapter four attend to practical measuring of thermal profiles and their optimalization.
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