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REBALLING OF BGA PACKAGES USING PACE TF2700 EQUIPMENT
Roháček, Peter ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The Diploma thesis is focused on reballing of BGA packages with the device PACE TF 2700. It describes the general types of BGA packages, their defects, importance of thermal management to the solder techniques, where it is also talked about the meaning of solders and fluxes for the joint. The work informs about the most common methods of reballing, the proper handling of components and the current situation with BGA stencils on the market. It briefly describes the device operation of PACE TF 2700, that is working on the convection and IR principle of heating components. It deals with the manufacturing of the template, dummy BGA packages, the test plates, creation of the thermo profile, comparing and examining the defects and their causes, which had the most significant impact on the results. The achievements would serve for comparing them with the results of the future laboratory exercises or as a subject for further works.
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Modern methods of mixed-signal integrated circuit verification
Podzemný, Jakub ; Bohrn, Marek (referee) ; Fujcik, Lukáš (advisor)
This work aims at methods, which are suitable for mixed-signal integrated circuit verification. The emphasis is on the Assertion-based verification. In practice there are two languages, which can be used for this method - PSL and SystemVerilog. These languages are compared between each other and individually tested to find their capabilities, functional limits and restrictions. One of them will be integrated into verification flow of SCG Czech Design Center s. r. o. company to develop ABV methodology in analog and mixed-signal domain.
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Modern methods of mixed-signal integrated circuit verification
Podzemný, Jakub ; Bohrn, Marek (referee) ; Fujcik, Lukáš (advisor)
This work aims at methods, which are suitable for mixed-signal integrated circuit verification. The emphasis is on the Assertion-based verification. In practice there are two languages, which can be used for this method - PSL and SystemVerilog. These languages are compared between each other and individually tested to find their capabilities, functional limits and restrictions. One of them will be integrated into verification flow of SCG Czech Design Center s. r. o. company to develop ABV methodology in analog and mixed-signal domain.
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REBALLING OF BGA PACKAGES USING PACE TF2700 EQUIPMENT
Roháček, Peter ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The Diploma thesis is focused on reballing of BGA packages with the device PACE TF 2700. It describes the general types of BGA packages, their defects, importance of thermal management to the solder techniques, where it is also talked about the meaning of solders and fluxes for the joint. The work informs about the most common methods of reballing, the proper handling of components and the current situation with BGA stencils on the market. It briefly describes the device operation of PACE TF 2700, that is working on the convection and IR principle of heating components. It deals with the manufacturing of the template, dummy BGA packages, the test plates, creation of the thermo profile, comparing and examining the defects and their causes, which had the most significant impact on the results. The achievements would serve for comparing them with the results of the future laboratory exercises or as a subject for further works.
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