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Wetting of lead-free solders on ceramic substrates
Lipavský, Lubomír ; Otáhal, Alexandr (referee) ; Adámek, Martin (advisor)
This master's thesis deals with issue of lead-free soldering in protective atmosphere with focus on wetting test. Theorethical part is focused on the types of lead-free solders, wettability tests performed on solder joints, different types of soldering or comparison of influence of the base material in regards to the wetting of the solder. The goal of practical part is testing and comparison of spreadability of selected lead-free solder on two conductive surfaces with different concentration of oxygen in protective nitrogen atmosphere. Testing has been performed on ceramic substrate which differs this method from others, performed on organic substrate. For an over-melted solder, the crystal-growth on surface in regards to protective atmosphere concentration is shown.
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The strength of soldered joints on ceramic substrates
Jansa, Vojtěch ; Nicák, Michal (referee) ; Adámek, Martin (advisor)
This thesis deals with problematic of lead – free soldering and consequent testing of mechanical characteristics of solder joints. The theoretical part is focused on various types of lead – free solders, influence of protective atmosphere on the solders characteristics and mechanical testing of solder joints. Basic materials and thick - films making technology is mentioned. Practical part contains a design of topology that was used for mechanical strength testing of solder joints connecting SMD component and ceramic substrate. Properties of lead – free solder pastes was investigated on various concentrations of O2 and compared with lead soldering paste.
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The comparison of properties of solder joints on ceramic substrates by shear tests
Lipavský, Lubomír ; Schnederle, Petr (referee) ; Adámek, Martin (advisor)
This thesis deals with issues lead – free soldering in a protective atmosphere with a focus on mechanical tests. The theoretical part is focused on the types of lead-free solders, mechanical tests carried on the solder joints and various methods reflow soldering. It is also discussed reliability and durability of solder joints. Aim of the practical part is to compare the strength of solder joints using shear tests for various sizes of components, various concentrations of protective nitrogen atmosphere and various types of solder pastes. Testing is performed on a ceramic substrate, which differs from the works being carried on an organic substrate. For each type of solder paste is further processed by the percentage occurrences of each type tearing of solder joint.
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The strength of soldered joints on ceramic substrates
Jansa, Vojtěch ; Nicák, Michal (referee) ; Adámek, Martin (advisor)
This thesis deals with problematic of lead – free soldering and consequent testing of mechanical characteristics of solder joints. The theoretical part is focused on various types of lead – free solders, influence of protective atmosphere on the solders characteristics and mechanical testing of solder joints. Basic materials and thick - films making technology is mentioned. Practical part contains a design of topology that was used for mechanical strength testing of solder joints connecting SMD component and ceramic substrate. Properties of lead – free solder pastes was investigated on various concentrations of O2 and compared with lead soldering paste.
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The comparison of properties of solder joints on ceramic substrates by shear tests
Lipavský, Lubomír ; Schnederle, Petr (referee) ; Adámek, Martin (advisor)
This thesis deals with issues lead – free soldering in a protective atmosphere with a focus on mechanical tests. The theoretical part is focused on the types of lead-free solders, mechanical tests carried on the solder joints and various methods reflow soldering. It is also discussed reliability and durability of solder joints. Aim of the practical part is to compare the strength of solder joints using shear tests for various sizes of components, various concentrations of protective nitrogen atmosphere and various types of solder pastes. Testing is performed on a ceramic substrate, which differs from the works being carried on an organic substrate. For each type of solder paste is further processed by the percentage occurrences of each type tearing of solder joint.
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Wetting of lead-free solders on ceramic substrates
Lipavský, Lubomír ; Otáhal, Alexandr (referee) ; Adámek, Martin (advisor)
This master's thesis deals with issue of lead-free soldering in protective atmosphere with focus on wetting test. Theorethical part is focused on the types of lead-free solders, wettability tests performed on solder joints, different types of soldering or comparison of influence of the base material in regards to the wetting of the solder. The goal of practical part is testing and comparison of spreadability of selected lead-free solder on two conductive surfaces with different concentration of oxygen in protective nitrogen atmosphere. Testing has been performed on ceramic substrate which differs this method from others, performed on organic substrate. For an over-melted solder, the crystal-growth on surface in regards to protective atmosphere concentration is shown.
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