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Delayering of semiconductor chips
 Valachovič, Marek ; Adámek, Martin (referee) ; Búran, Martin (advisor)
This work describes the individual layers of whitch the semiconductor chip is composed, the types of packages in witch it can be encapsulated and the methods of connecting the chip with the package. Furthermore, the methods of dacapsulating the encapsulated chip and delayering using several different methods, such as mechanical, chemical, plasmatic, or using an focused ion beam, are describe here. The methods of mechanical and chemical delayering of the layers of the semiconductor chip togeaher with dalayering by focused ion beam with the help of gas are practically performed and recorded.
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