|
Lead-free solder joint and environmental impacts
Kudláček, František ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The aim of this bachelor thesis is to determine the effect of low-temperature lead-free solder during the aging process. The theoretical part deals with the types of lead-free solders and solder pastes used for the production of electrical circuits. In the practical part we deal with the design and measurement of the PCB. For our analysis, we pay more attention to the solder paste type Sn42Ag1Bi57 and its temperature profile. A four-point measurement method is used for evaluation, which shows us the difference between the measured values.
|
| |
| |
| |
| |