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Semiconductor chip interconnection
Mareš, Petr ; Vaško, Cyril (referee) ; Novotný, Marek (advisor)
The Bachelor Thesis deals with contacting semiconductor chips using wirebonding. Opening chapters devoted to technology interconnect chips with the enviroment and materials to use. Much of this work is devoted to simulation wirebonding connections in Ansys. The simulations are engaged in examining thermomechanical stress in wires and current density at contacts.Results carried out simulations are measured with a focus on reliability and stressability of individual wirebonding connections. Part of this work is also practical measurements current stressability of wirebonding connections. At the end of the work was examined how to change the current stressability wires after the application of glue on contact.
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The remote-control workplace of sensor technology
Knopp, Daniel ; Vaško, Cyril (referee) ; Adámek, Martin (advisor)
This thesis is focused on a specific virtual laboratory support, which is designed and created as a device capable of data transferring to display and/or computational unit via serial port. Both the device and common PC are generally a corner stone of each virtual laboratory, which can be also accessed via internet. Technique, significant factors with impact of analog disturbances on digital communication and realization of standalone virtual laboratory are described in detail.
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Cooling effect on growth of intermetallic compounds in lead-free solder joints
Faldyna, Martin ; Novotný, Marek (referee) ; Vaško, Cyril (advisor)
This work deals with issues of process optimalization of lead-free soldering. The aim of this work is demonstrate of cooling on grow intermetallic layers during lead-free solde ring process and a hold intensity of cooling on joint quality. The experiment was performed with two types of solder pastes: Sn/Ag/Cu a Sn/Bi/Zn. The final samples were appraised in light of wet-ting, size of intermetallic layers, optical estimation solder and sudar stress test.
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Virtual laboratory modul development
Volf, Lukáš ; Novotný, Marek (referee) ; Vaško, Cyril (advisor)
Virtual laboratory is project aimed at creation of modern teaching instrument, which should help to students of microelectronics, but not only them, to understand questions of surface mount technology and packaging in electrotechnics. This work deals with analysis one of substantial part of the project, which is creation of interactive animations helping to understand questions of a given problems. In this work are described partial technological processes and their sequential application into interactive multimedia format.
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Modelling of microelectronic structures properties
Luňáček, Erik ; Řezníček, Michal (referee) ; Vaško, Cyril (advisor)
This work is focused on thermomechanical and electric analyses of microelectronic structures in the ANSYS program. Firstly an analysed model was formed in the program Solidworks. Then structures with components SOT23, SMD 1206, FlipChip and chip with wire bonding interconnection were analyzed. The analyses were performed for the temperatures 50, 100, 150 °C and various materials. The simulations outputs are presented as pictures in colours with models deformations and calculated values. The results will be utilised in education and presented on the web. The Flash, ActionScript and XML technologies were used for application to present results of the research.
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Semiconductor chip interconnection
Mareš, Petr ; Vaško, Cyril (referee) ; Novotný, Marek (advisor)
The Bachelor Thesis deals with contacting semiconductor chips using wirebonding. Opening chapters devoted to technology interconnect chips with the enviroment and materials to use. Much of this work is devoted to simulation wirebonding connections in Ansys. The simulations are engaged in examining thermomechanical stress in wires and current density at contacts.Results carried out simulations are measured with a focus on reliability and stressability of individual wirebonding connections. Part of this work is also practical measurements current stressability of wirebonding connections. At the end of the work was examined how to change the current stressability wires after the application of glue on contact.
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Cooling effect on growth of intermetallic compounds in lead-free solder joints
Faldyna, Martin ; Novotný, Marek (referee) ; Vaško, Cyril (advisor)
This work deals with issues of process optimalization of lead-free soldering. The aim of this work is demonstrate of cooling on grow intermetallic layers during lead-free solde ring process and a hold intensity of cooling on joint quality. The experiment was performed with two types of solder pastes: Sn/Ag/Cu a Sn/Bi/Zn. The final samples were appraised in light of wet-ting, size of intermetallic layers, optical estimation solder and sudar stress test.
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