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The strength of soldered joints on ceramic substrates
Jansa, Vojtěch ; Nicák, Michal (referee) ; Adámek, Martin (advisor)
This thesis deals with problematic of lead – free soldering and consequent testing of mechanical characteristics of solder joints. The theoretical part is focused on various types of lead – free solders, influence of protective atmosphere on the solders characteristics and mechanical testing of solder joints. Basic materials and thick - films making technology is mentioned. Practical part contains a design of topology that was used for mechanical strength testing of solder joints connecting SMD component and ceramic substrate. Properties of lead – free solder pastes was investigated on various concentrations of O2 and compared with lead soldering paste.
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Optimalization of soldering process on IR-400
Otáhal, Alexandr ; Nicák, Michal (referee) ; Szendiuch, Ivan (advisor)
This project deals with innovation of IR-400 equipment which is based on design and installation of temperature regulation, in both top and bottom side. This innovation enables adjustment of reflow temperature profile for repair and rework of SMD components by lead-free solder materials for both, FR4 and alumina substrates, as assembly of some special packages.
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Parameters of BGA-type interconnection joints ceramic Al2O3 substrates
Somer, Jakub ; Švecová, Olga (referee) ; Nicák, Michal (advisor)
This project deals with questions related to parameters of solder balls, used on BGA packages, on ceramic substrates. First part of this project contains general characteristic of solder balls, their properties and usage. In the following part there are described technologies and methods used during the experiment including the design of test substrate. The last part is dedicated to practical examination of compatibility of selected conductive pastes, solder pastes and fluxes during vapor reflow soldering. At the end of this work the selection of materials, assembly, soldering and microsections are described.
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Interconnection Technologies for 3D Electronic and Microelectronic Constructions
Nicák, Michal ; Pietriková,, Alena (referee) ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
The doctoral thesis is focused on research on application possibilities of soldered interconnection structures especially for the use with innovative 3D structures assembled using the LTCC ceramic materials, PVD deposited and galvanically modified pads, solid core solder balls. It consists of several main parts. Introduction is followed by theoretical survey of current situation and technologies. Thesis continues with introduction of main goals and with summary of successively performed experiments and their results. End of the work belongs to summary of results and gained knowledge.
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Advancing Packiging and 3D systems
Nicák, Michal ; Šandera, Josef (referee) ; Szendiuch, Ivan (advisor)
This project consists of three parts. The first part is aimed to summarize list of actual packaging systems and especially systems using 3D construction. Project continues in the second part, which is more practical and contains design and production of organic and inorganic testing substrates for lead-free soldered 3D structures. Last experimental part is about tests performed on soldered substrates and evaluation of results of these practical tests.
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Design and realisation of solder-ball mounting device
Bobek, Josef ; Szendiuch, Ivan (referee) ; Nicák, Michal (advisor)
This work deals with issues of design and construction of facilities for mounting solder balls. The first part includes a familiarization with the types, manufacture and assembly of solder balls in practice. The following section includes the actual construction work on the equipment, procedures, considerations and finish work on the plant. The last part provides information about solder balls testing, which are mounted on the FRITSCH station, and compares potential errors.
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Design and realisation of modifications for metalographic microsection device
Bránecký, Martin ; Adámek, Martin (referee) ; Nicák, Michal (advisor)
This work deals with the metallographic grindings of metallographic samples. The work introduces the reader to the basic principles of metallography and metallographic grindings. Project is especially focused on the quality metallographic grindings, namely from dividing of sample to investigation material of sample, focusing on the grinding of metallographic grindings. The main work is to propose modifications and realizations to the device ROW Rathenow – Metasinex, which is used for grinding of metallographic samples. Modifications are directed towards the automation of device and increase safety in the use of the device. Specifically, the application of additional the sliding arm with clamping mechanism for samples on the device and application control several electronic components.
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Interconnection Technologies for 3D Electronic and Microelectronic Constructions
Nicák, Michal ; Pietriková,, Alena (referee) ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
The doctoral thesis is focused on research on application possibilities of soldered interconnection structures especially for the use with innovative 3D structures assembled using the LTCC ceramic materials, PVD deposited and galvanically modified pads, solid core solder balls. It consists of several main parts. Introduction is followed by theoretical survey of current situation and technologies. Thesis continues with introduction of main goals and with summary of successively performed experiments and their results. End of the work belongs to summary of results and gained knowledge.
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Design and realisation of solder-ball mounting device
Bobek, Josef ; Szendiuch, Ivan (referee) ; Nicák, Michal (advisor)
This work deals with issues of design and construction of facilities for mounting solder balls. The first part includes a familiarization with the types, manufacture and assembly of solder balls in practice. The following section includes the actual construction work on the equipment, procedures, considerations and finish work on the plant. The last part provides information about solder balls testing, which are mounted on the FRITSCH station, and compares potential errors.
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Design and realisation of modifications for metalographic microsection device
Bránecký, Martin ; Adámek, Martin (referee) ; Nicák, Michal (advisor)
This work deals with the metallographic grindings of metallographic samples. The work introduces the reader to the basic principles of metallography and metallographic grindings. Project is especially focused on the quality metallographic grindings, namely from dividing of sample to investigation material of sample, focusing on the grinding of metallographic grindings. The main work is to propose modifications and realizations to the device ROW Rathenow – Metasinex, which is used for grinding of metallographic samples. Modifications are directed towards the automation of device and increase safety in the use of the device. Specifically, the application of additional the sliding arm with clamping mechanism for samples on the device and application control several electronic components.
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