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Viscometer adjustment for materials of higher viscosity
Laryš, Šimon ; Jankovský, Jaroslav (referee) ; Otáhal, Alexandr (advisor)
The aim of this bachelor‘s thesis is to rebuild and verify the functionality of an old SHEEN CP1 viscometer for measuring soldering and thick-film pastes according to the design from the semester project. The theoretical part presents the basic viscosity calculations for newtonian and non-newtonian substances. The basic methods of viscosity measurement for different types of substances are also explained here. The greatest emphasis is placed on devices that can measure thixotropic substances. The practical part presents a design for a method which reduces the speed of the viscometer and a design for the interconnection of individual components from the semester project and its assembly. Following part contains description of the modules and sensors used and the program part with libraries where functions for individual peripherals were created and explained. The connection of individual components is also explained here. Finally, the functionality of the modified viscometer is verified by measuring the soldering and thick-film paste.
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Economic encapsulation for integrated circuits and modules
Kristek, Michal ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This Master´s thesis is about ways of packages of integration circuits and modules. Especially it´s about non-hermetic types of packages. One part of this paper are basic information about packaging and aspects in design of package. Next parts are design of test samples, which are package to epoxide powder material. Based on the results of the tests method, it will propose, where the technology will be used.
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Realization of hybrid integrated circuits leads for high-temperature applications
Valíček, Jan ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
Bachelor thesis deals with realization possibilities of hybrid integrated circuit terminals for high temperature applications. It describes the realization method of direct mounting of terminals, this method of fixation using the conductive paste for the thick film technology. It also describes the selection of suitable materials and the temperature profile in the reflow and muffle furnace and follow removal of terminal oxides. Furthermore, a method for testing of terminals thermal resistance was realized. In conclusion, the method shows increased mechanical strength with the using of dielectric paste.
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Design and optimization of soldering process of solder glasses
Vinklerová, Viktorie ; Jankovský, Jaroslav (referee) ; Otáhal, Alexandr (advisor)
The bachelor‘s thesis deals with solder glasses, its physical properties and types. The work also includes a discussion about heating methods, soldering equipment, soldering process and material compatibility of various metal alloys, metals and sealing materials. The aim of the work is to optimize the soldering process of the glass solder G018-266, which is compatible with Al2O3 and the subsequent realization of the ceramic casing. The work also describes the measurement of the strength of the formed joint in the shear.
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Research of the influence of a new method for ball-attach process on BGA packages on intermetallic layers
Gregor, Adam ; Jankovský, Jaroslav (referee) ; Otáhal, Alexandr (advisor)
This work deals with exploring a new method of ball-attach process on BGA packages using a directly heated stencil. The existing procedures of making solder bumps were compared with possible benefits of using this new method. The methodology was established to create samples using a new reflow method and its effect on the formation and strength of intermetallic layers of solder bumps, due to the set height of the heated template, which was designed for reflow of BGA terminals. In addition to the design of the methodology, shear tests and metallographic sections of the samples were also performed. The thickness of the intermetallic layer and its roughness were examined. An evaluation of the results was performed on the basis of which a new method of reflow soldering of solder balls on BGA packages was optimized.
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Optimizing of QFN Package Assembly Process
Šváb, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
The Master thesis deals with technology of mounting QFN packages on to the printed circuits boards. Describes also influence of shape and size of soldering pads and the amount of soldering paste with respect to the quality and the reliability. In first part overview of existing packages is summarised. Second part describes design of testing board and the factors which leads to eliminating errors during manufacturing process.
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Controlled rectifier bridge
Kučírek, Martin ; Řezníček, Michal (referee) ; Jankovský, Jaroslav (advisor)
This bachelor's thesis is concerned with problems of monophasic full-wave rectifiers - describes the components used in wiring monophasic full-wave uncontrolled rectifier (Graetz rectifier) and controlled with power MOSFETs and IC LT4320 in the theoretical part. The practical part explains manufacturing process controlled rectifier bridge in the form of embedded system. On the final product is carried out measurement and comparison with commercial uncontrolled monophasic full-wave rectifier.
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