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Termodynamické re-modelování systému Cu-Ni-Sn
Zemanová, Adéla ; Kroupa, Aleš
The Cu-Ni-Sn system is an important alloy system in lead-free soldering. In the scope project COST 531 the binary data for the Ni-Sn system required modification. The high temperature form of Ni3Sn, which has a DO3 structure, was modeled as BCC_A2 in the COST 531 thermodynamic database for compatibility with Cu-Sn system. The reassessment of this phase was carried out with the help of Parrot module in the ThermoCalc software and very good agreement was reached comparing the partial quantities from previous data and new model of this phase. Nevertheless it was also necessary to remodel the description of the Cu-Ni-Sn ternary system. The reassessment was based on the work of Miettinen who was primarily concerned with copper-rich compositions and experimental data for lower temperature.

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