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Monitoring of Solder Spreading Velocity on Metal Surface
Růžička, Miroslav ; Dušek,, Karel (referee) ; Starý, Jiří (advisor)
This work deals with flushing monitoring of spreading velocity on solder finishes Niau, OSP, Sn deposited on copper plated base material FR4 using digital cameras. After the reflow process is measured by length of spreading solder and size of wetting angle. It evaluates and compares the time dependence of velocity of spreading solder, length of solder spreading and wetting angle for NiAu, OSP, Sn finishes at different temperatures reflow and surface treatment.
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Wetting and Spreading of Solder on PCB Surface
Wiesner, Lukáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work deals with the metal surface wetting problems of molten lead-free solder and monitoring of ongoing processes at the inter-phase interface. This work also deals with flushing monitoring of spreading velocity on solder finishes Ni/Au and Immersion Sn deposited on copper plated base material FR4 using digital cameras. Measurement is performed at the improved workplace. After the reflow process is measured by length of spreading solder. It evaluates and compares the time dependence of velocity of spreading solder for Ni/Au and Immersion Sn finishes.
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Wetting and Spreading of Solder on PCB Surface
Wiesner, Lukáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work deals with the metal surface wetting problems of molten lead-free solder and monitoring of ongoing processes at the inter-phase interface. This work also deals with flushing monitoring of spreading velocity on solder finishes Ni/Au and Immersion Sn deposited on copper plated base material FR4 using digital cameras. Measurement is performed at the improved workplace. After the reflow process is measured by length of spreading solder. It evaluates and compares the time dependence of velocity of spreading solder for Ni/Au and Immersion Sn finishes.
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Monitoring of Solder Spreading Velocity on Metal Surface
Růžička, Miroslav ; Dušek,, Karel (referee) ; Starý, Jiří (advisor)
This work deals with flushing monitoring of spreading velocity on solder finishes Niau, OSP, Sn deposited on copper plated base material FR4 using digital cameras. After the reflow process is measured by length of spreading solder and size of wetting angle. It evaluates and compares the time dependence of velocity of spreading solder, length of solder spreading and wetting angle for NiAu, OSP, Sn finishes at different temperatures reflow and surface treatment.
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