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Design of Digital Soldering Station
Matušková, Adéla ; John, David (referee) ; Rubínová, Dana (advisor)
The subject of this Bachelor’s Thesis is a design of a digital soldering station, which is defined for amateurs, but also for professionals. The aim is to design a soldering station following user´s comfort, safety and technological and structural requirements. This project includes the analysis of current products, deals with entered aims of the work and describes the final solution.
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Rework and Repair Procedures of Selected Components and LED on Various Types of PCBs.
Pospíšil, Tomáš ; Ondřej, Klemš (referee) ; Starý, Jiří (advisor)
This work deals with technology of rework and repairs of electronic soldering assemblies. The work is primarily focused on the rework and repairs of electronic soldering assemblies with the light emitting diode. The theoretical part describes the technological methods of soldering and reworking of electronic assemblies, their diagnostics, evaluation of their influence on reliability and functional properties. The practical part is focused on the real application of technological procedures of rework and repairs, their testing and evaluation. Furthermore there is described and tested the influence of thermal load during soldering on the properties of light emitting diodes.
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Optimization of surface treatment of stainless steels
Mačátová, Lucie ; Žák, Ladislav (referee) ; Kubíček, Jaroslav (advisor)
The project deals with the processes of degreasing industry and testing new laser cleaning process, which has been experimentally verified and tested in the production process. Project also deals with soldering in general as a technology of joining metals. Included are the main components of the soldering, such as solder, flux, the types of connections and their use, ways of soldering and last but not least the soldering corrosion-resistant steel.
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Reliability of LED Panels Solder Joints
Šimon, Vojtěch ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Thesis is focused on the effect of heating factor on quality of solder joints. In theoretical part is solved reflow soldering technology, problematice of solder paste choice or criteria of soldering profile setting. The practical part is dedicated to demonstrating the impact of heating factor on solder joint quality. There are used X-Ray analysis, microsections and electron microscopy. In the final part of this thesis are summarized knowledge from theoretical part and experimental obtained results to defend of next steps in diploma thesis.
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Optimization of surface treatment of stainless steels
Mačátová, Lucie ; Žák, Ladislav (referee) ; Kubíček, Jaroslav (advisor)
The project deals with the processes of degreasing industry and testing new laser cleaning process, which has been experimentally verified and tested in the production process. Project also deals with soldering in general as a technology of joining metals. Included are the main components of the soldering, such as solder, flux, the types of connections and their use, ways of soldering and last but not least the soldering corrosion-resistant steel.
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REBALLING OF BGA PACKAGES USING PACE TF2700 EQUIPMENT
Roháček, Peter ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The Diploma thesis is focused on reballing of BGA packages with the device PACE TF 2700. It describes the general types of BGA packages, their defects, importance of thermal management to the solder techniques, where it is also talked about the meaning of solders and fluxes for the joint. The work informs about the most common methods of reballing, the proper handling of components and the current situation with BGA stencils on the market. It briefly describes the device operation of PACE TF 2700, that is working on the convection and IR principle of heating components. It deals with the manufacturing of the template, dummy BGA packages, the test plates, creation of the thermo profile, comparing and examining the defects and their causes, which had the most significant impact on the results. The achievements would serve for comparing them with the results of the future laboratory exercises or as a subject for further works.
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Comparison of solders for power modules
Spaček, Marek ; Boušek, Jaroslav (referee) ; Hejátková, Edita (advisor)
Táto práca podáva náhľad na výkonové polovodičové moduly, technológie v nich požívané a niektoré procesy používané na ich výrobu. Popisuje aj niektoré kvalitatívne kritériá pre spájkovaný spoj medzi DBC substrátom modulu a jeho základovou doskou a metódy používané na ich inšpekciu. Na koniec porovnáva vlastnosti 6-zložkovej vysoko spoľahlivostnej spájky 90iSC vyvinutej firmou Henkel so štandardnou spájkou požívanou na výrobu modulov vo firme SEMIKRON pri použitím rôznych spájkovacích programov, použitím röntgenovej inšpekcie, SAM a metalurgických rezov.
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Mini reflow oven
Pavelka, Radek ; Jelínek, Aleš (referee) ; Burian, František (advisor)
This thesis is aimed to design a small oven for PCB soldering using the reflow method. It contains description of the oven’s construction, it’s thermodynamic parameters and the design of the control and power unit PCB as well as their control software. A remote PC control and monitoring application is also a part of this thesis.
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