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The possibilities of SMD components soldering by equipment Fritsch
Juračka, Martin ; Šandera, Josef (referee) ; Adámek, Martin (advisor)
This thesis focuses on soldering technology in microelectronics. It describes in detail the basic ways of soldering and repairs in electronics. This piece of work shows the principles of technological equipment for bulk soldering and used repairing devices. In the theoretical part of this work there are also briefly described the packages for integrated circuits that were used in the practical part of the thesis. The practical part of the thesis deals with setting of the heat profiles for hot air repair station Fritsch Mikroplacer for LQFP64, SOIC16, TSSOP14, QFN16 and DSBGA5 packages. The heat profiles for assembly and disassembly of the particular types of the packages on designed and manufactured test printed circuit board were set and tested. The resulting heat profiles are compared with the recommended heat profile of an ordinary solder paste SnAg3Cu0,5 which was used for the test. This thesis can serve as an aid for the further settings of heat profiles in other types of packages not only on Fritsch Mikroplacer devices, but also on other repairing devices of this type.
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Testing of Solders in Protection Atmosphere
Vala, Radek ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
The project deals with the overall design and construction of equipment called the desiccators for brazing in a protective atmosphere. The device was designed and manufactured cooling and heating element. For the soldering various temperature profiles have been defined and adjusted, as for SnPb as well for lead-free solders. There was a realization of samples were measured and analyzed. Finally were realized micro sections for lead free solder.
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Research of the Quality of Solder Joints by BGA and QFN Packages
Otáhal, Alexandr ; Adámek, Martin (referee) ; Szendiuch, Ivan (advisor)
This diplomas thesis deals with specific technologies and manufacture of BGA and QFN packages. Also summarizes the most used test methods for assessing the reliability for. Describes the making of equipment for soldering in a nitrogen atmosphere, followed by comparison solder joints of BGA and QFN forming in different atmosphere. Finally, summarizes knowledge about the process of soldering and desoldering lead-free solders for BGA packages, followed by experimental evaluation of the causes of malfunction of repaired samples.
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Research of the reliability of lead-free solder joints
Pelc, Miroslav ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
This work deals research of the reliability of leed-free solder joints. It summarizes the basic knowledge of lead-free solder alloys, soldering and testing process, the soldered joints. The work is done selecting the most important factors entering into the soldering process. The method of the DOE sought the optimal combination of factors, which would correspond to the highest quality solder joints.
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