National Repository of Grey Literature 12 records found  previous11 - 12  jump to record: Search took 0.02 seconds. 
Research of the reliability of lead-free solder joints
Pelc, Miroslav ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
This work deals research of the reliability of leed-free solder joints. It summarizes the basic knowledge of lead-free solder alloys, soldering and testing process, the soldered joints. The work is done selecting the most important factors entering into the soldering process. The method of the DOE sought the optimal combination of factors, which would correspond to the highest quality solder joints.
Solder Joint Reliability and Wetting Characteristics Influence
Labaj, Radek ; Stejskal, Petr (referee) ; Starý, Jiří (advisor)
This thesis deals with the methodology of testing the wetting characteristics for different material and process effects in the double-plated base material. Testing is performed by wetting balance method. There is designed procedure to calculate the angles on each side of the non-homogeneous material. The Design of Experiments method is used to interpret the results, by using this method are also interpreted electrical and mechanical properties of solder joints. The correlation with wetting characteristics is discussed.

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