Národní úložiště šedé literatury Nalezeno 2 záznamů.  Hledání trvalo 0.03 vteřin. 
Defectoscopy of thin polymer layers using computer vision
Podstránský, Jáchym ; Sobola, Dinara (oponent) ; Knápek, Alexandr (vedoucí práce)
In the electron beam lithography process, one of the first steps is to coat the substrate, the wafer, with a thin layer of polymer resist. During the coating process, defects occur that can affect the exposure and therefore the functionality of the final nanostructure. By checking the quality of the deposited resin prior to exposure, these defect sites can be avoided. This process can be done manually using a light microscope, but it is a time consuming process. In the framework of this bachelor thesis, a device has been developed that can detect these defects automatically. It is a rasterising device that, by combining two stepper motors and an optical camera, takes images of the desired area of the wafer and then analyses these with the help of artificial intelligence. The user is then provided with a document in which the size, position and type of each defect found is recorded.
Defectoscopy of thin polymer layers using computer vision
Podstránský, Jáchym ; Sobola, Dinara (oponent) ; Knápek, Alexandr (vedoucí práce)
In the electron beam lithography process, one of the first steps is to coat the substrate, the wafer, with a thin layer of polymer resist. During the coating process, defects occur that can affect the exposure and therefore the functionality of the final nanostructure. By checking the quality of the deposited resin prior to exposure, these defect sites can be avoided. This process can be done manually using a light microscope, but it is a time consuming process. In the framework of this bachelor thesis, a device has been developed that can detect these defects automatically. It is a rasterising device that, by combining two stepper motors and an optical camera, takes images of the desired area of the wafer and then analyses these with the help of artificial intelligence. The user is then provided with a document in which the size, position and type of each defect found is recorded.

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