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Solder Joint Reliability and Wetting Characteristics Influence
Labaj, Radek ; Stejskal, Petr (referee) ; Starý, Jiří (advisor)
This thesis deals with the methodology of testing the wetting characteristics for different material and process effects in the double-plated base material. Testing is performed by wetting balance method. There is designed procedure to calculate the angles on each side of the non-homogeneous material. The Design of Experiments method is used to interpret the results, by using this method are also interpreted electrical and mechanical properties of solder joints. The correlation with wetting characteristics is discussed.
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Laser diode soldering
Straka, Michal ; Holík, Milan (referee) ; Stejskal, Petr (advisor)
This work deals with the laser diode soldering. The theoretical part summarizes general and acquired findings about soldering technology and materials that occur in this process. It also describes factors that affect the reliability of solder joints. It is closely focused to the shaping of the solder joint and structure of intermetallic layer. The practical part of this work is focused on the design of equipment for laser diode soldering and subsequent shaping of the samples. The quality of soldered joint is compared against the quality of joint created using re-flow technology - remelting in in-line smelter. The structure and thickness of the intermetallic layer, the number and shape of the voids in the solder joints are compared.
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Inspection of PCB with SMT by using comparative method
Hejdiš, Roman ; Stejskal, Petr (referee) ; Starý, Jiří (advisor)
The first part of the bachelor´s thesis discuss AOI, types of AOI, its utilization and importance in the industrial production. The second part is devoted to realization of simple comparative inspection method. There were testing effects of ambient light to record photographs of PCB and also artificial light was used. There was problems indication of PCB lit and PCB fixturing. At last, there are discussed some technical problems of this simple comparative method.
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Mechanical Properties of solder joint
Meliš, Josef ; Starý, Jiří (referee) ; Stejskal, Petr (advisor)
This thesis deals with the differences between the mechanical properties of surface conditionings of the printed circuit boards and various types of soldering pastes. The practical part of the thesis describes all the steps necessary to conduct the experiment. The experiment will evaluate the measured mechanical strength of the solder joint for each surface conditioning, the types of solders, the increase in thickness of the intermetalic layer during long-term aging and the change in the structure of the solder joint.
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Solder Joint Electric Conductivity and Solder Joint Reliability
Lačný, Radek ; Stejskal, Petr (referee) ; Starý, Jiří (advisor)
This work is considered about changes of electric conductivity in lead-free soldered joint's affected by current and thermal stress. The theoretical part describes factors influencing the solder joint electric conductivity and solder joint reliability. The basis of the practical part is the design of the testing method of the soldered joint's electric conductivity. The aim of this part is to measure and observe changes of solder joint electric conductivity after current and thermal stress in various material a procedural combinations.
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Solder Joint Reliability Prediction
Stejskal, Petr ; Skočil, Vlastimil (referee) ; Hovorka, Ladislav (referee) ; Kazelle, Jiří (advisor)
The thesis deals issue of the solder joint reliability and diagnostics. The manufacturing technology of electronics currently features a very high level of perfection. A large number of electrical devices ends its functional life due to solder joint failure. The objective of presented research consists studies of processes taking place in the solder joint due to soldering and after soldering. To this end, I will employ several methods of diagnostics. Noise based methods of solder joint measurement was evaluated. Based on a detailed study and understanding of processes it can be solder joint reliability predicted.
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Reliability of lead free solder joint
Paško, Martin ; Knotek, Tomáš (referee) ; Stejskal, Petr (advisor)
This thesis deals with voids formation in lead-free soldered joint. In theoretical part are described types of voids, voids formation, effect on join reliability, effect reflow profile on voids formation and effect of surface finish on voids formation. In practical part is investigated a effect of thermal stress on voids growth.
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The production process optimizing using methods of industrial engineering
Schnederle, Petr ; Vychroň, Aleš (referee) ; Stejskal, Petr (advisor)
The thesis developed in the field of study Electrical Manufacturing and Management is aimed at optimizing and streamlining of production plastics vacuum forming plastics technology rolled in a particular company. The theoretical part focused on the description of the principles of industrial engineering and survey methods that are fundamentals of lean manufacturing or the Toyota production system. The larger part is devoted to methods of 5S and SMED. The practical part of the optimization steps are designed to ensure increased production, balanced production and increase quality, which are based primarily on methods of 5S and SMED. To complement the work given the changes in production processes resulting from other methods of industrial engineering. Several proposals have been practically applied in the production are assessed and their benefits.
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Single-layer PCB and additional conductive layer realisation
Hladík, Jaroslav ; Stejskal, Petr (referee) ; Starý, Jiří (advisor)
This bachelor’s thesis deals with problems following the fabrication of the second conductive layer on a one-sided printed circuit board. Also, properties of basic materials for a printed circuitboard farbication and combinations of basic materials are disscussed. Moreover, technological tests and their evaluation made according to recommended norms are content of this thesis.
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