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Conducting connections of ceramic with FR4 in 3D structure
Pelc, Miroslav ; Adámek, Martin (referee) ; Kosina, Petr (advisor)
This work deals with conductive connections ceramic substrate with FR4 into three – dimensional structure. High frequency amplifier was created on ceramic substrate as a concrete application, for check quality substrate on resulting behavior circuit. The supply voltage for this amplifier is provided by the DC voltage source developed for FR4. Further the thesis deals with quality verification of substances conductive connection and individual aspects, with affect resulting reliability of connection.
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Research of the reliability of lead-free solder joints
Pelc, Miroslav ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
This work deals research of the reliability of leed-free solder joints. It summarizes the basic knowledge of lead-free solder alloys, soldering and testing process, the soldered joints. The work is done selecting the most important factors entering into the soldering process. The method of the DOE sought the optimal combination of factors, which would correspond to the highest quality solder joints.
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Conducting connections of ceramic with FR4 in 3D structure
Pelc, Miroslav ; Adámek, Martin (referee) ; Kosina, Petr (advisor)
This work deals with conductive connections ceramic substrate with FR4 into three – dimensional structure. High frequency amplifier was created on ceramic substrate as a concrete application, for check quality substrate on resulting behavior circuit. The supply voltage for this amplifier is provided by the DC voltage source developed for FR4. Further the thesis deals with quality verification of substances conductive connection and individual aspects, with affect resulting reliability of connection.
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Research of the reliability of lead-free solder joints
Pelc, Miroslav ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
This work deals research of the reliability of leed-free solder joints. It summarizes the basic knowledge of lead-free solder alloys, soldering and testing process, the soldered joints. The work is done selecting the most important factors entering into the soldering process. The method of the DOE sought the optimal combination of factors, which would correspond to the highest quality solder joints.
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