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Research and Development of 2D/3D Deformable Structures LTCC for Optoelectronic Applications
Somer, Jakub ; Pietriková,, Alena (referee) ; Husák, Miroslav (referee) ; Szendiuch, Ivan (advisor)
The doctoral thesis is focused on the research, development and production of deformation elements produced by LTCC technology for use in optoelectronic applications. A study of technological processes is carried out, with the emphasis on achieving accurate and reproducible mechanical component manufacturing so that these can be used on standard LTCC substrates in the commercial sphere. Therefore, available standard thick-film materials are used. The work also involves testing the suitability of the use of standard LTCC materials for selected sensory applications in which fiber optics are used to confirm the usefulness of the results achieved in practice. The dissertable core of the work is research and development of a technology using new principles and possibilities hidden in the mechanical parameters of LTCC structures, which are designed and used for the realization of deformation elements. The work also involves testing the suitability of the use of standard LTCC materials for selected sensory applications in which fiber optics are used to confirm the usefulness of the results achieved in practice.
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Thermal aging of lead-free joints on ceramics
Cingel, Štefan ; Szendiuch, Ivan (referee) ; Adámek, Martin (advisor)
This diploma thesis aims to verify the properties of lead-free solders, which are subjected to accelerated aging by thermal cycling. The theoretical part describes in detail the most used lead-free solders and their characteristics. The next section describes fluxes and their important functions in the soldering process. Intermetallic compounds are also mentioned, which significantly affect the quality and service life of the soldered joint. In the practical parts, the test motif was on two different substrates - corundum ceramics and the widely used substrate FR-4 (Glass fiber fabric saturated with epoxy resin). SAC solder was chosen as the reference solder for the experiment, followed by solder containing bismuth (Sn42 / Bi58) and lead solder (Sn62 / Pb36 / Ag2). Accelerated aging by thermal cycling was performed in the temperature range from -20 ° C to 125 ° C, followed by performing a test of the mechanical strength of the soldered joint by means of a shear test. SnBi solder shows higher mechanical strength at the beginning of testing than SAC solder and lead solder, during temperature cycles, it significantly loses its mechanical properties, this is caused by increasing oxidation of the alloy. SAC solder seems to be promising, which has an almost constant decrease in mechanical strength during all temperature cycles on both corundum and FR-4 substrates.
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Optimization of Factors that Affects the Reliability of Soldering of Modern Electronic Packages
Otáhal, Alexandr ; Pietriková,, Alena (referee) ; Blecha,, Tomáš (referee) ; Szendiuch, Ivan (advisor)
The work deals with research and development of a new method for ball-attach process, resp. reballing process of solder bumps on package with solder ball terminals (BGA, CSP, SOP, etc.), based on research and optimization of the parameters of the final terminals. The output is specially modified templates designed for placement of solder balls before reflow soldering. Three materially different templates were investigated in the work, in addition to the commonly used stainless steel, two other newly designed templates, which used ceramic materials (96% Al2O3a AlN) with thick-layer resistance heating. Proven advantages of the method using templates directly heated by electric current are the reduction of the thermal load of BGA packages in the first soldering process, as well as the creation of a better connection between the metallization of the case and the solder ball after final soldering to the printed circuit board. During the research, development and optimization of the method, tests of the created solder bumps were performed from the point of view of mechanical strength and internal structure. In the next part of the work, a research of solder bumps soldered using infrared heaters was performed in order to determine the influence of the heat flow direction in the process of reflow soldering. The heaters were successively placed in three positions, i.e. heating from the bottom of the housing, heating from the top and both heaters simultaneously. After sample preparation, metallographic cuttings and etching, the analysis of the internal structure of the entire solder ball and the intermetallic layer at the interface of the solder and the solder pad was performed. The work represents not only a new method of soldering solder bumps, but also new knowledge to create their internal structure, which contributes to meeting the increasingly demanding requirements to achieve the required reliability and quality.
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Device for monitoring the environmental quality in the car
Doležal, Lukáš ; Szendiuch, Ivan (referee) ; Levek, Vladimír (advisor)
This bachelor's thesis deals with the design of equipment for monitoring the internal environment of the cabin of a passenger car. Equipment suitable for measuring force, atmospheric pressure, humidity, possible noise level and noise level. The main control element of the device is a microcontroller providing communication with the used sensors. The available data is shown on the display and is stored in memory. For communication with a computer, it is possible to use the USB interface using stored data that can be analyzed and processed.
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Ecological evaluation and labeling of electrical products
Kantorová, Aneta ; Šteffan, Pavel (referee) ; Szendiuch, Ivan (advisor)
This bachelor thesis is focused on the possibilities of reducing the negative effects of electrical products on the environment. After a general description of the current state, including activities aimed at awarding environmental labels, attention is focused on the possibilities of ecological evaluation of electrical products. Legislation according to the standards of the ISO 14020 series is applied for this that are focused on three possibilities of awarding eco-labels. In the practical part a procedure for awarding the ECO mark according to the ISO 14021 standard is proposed. This could be granted by the manufacturers themselves on compliance with the prescribed conditions as in the case of the declaration of conformity for the CE marking.
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Odor analysis program for experimental electronic nose
Janošíková, Pavla ; Szendiuch, Ivan (referee) ; Adámek, Martin (advisor)
This work deals with processing data acquired from sensory device known as electronic nose. The work introduces readers to a few possible designes of electronic noses and to some of the best known analysis for odor recognition that are used in food industry. The work focus on a principal component analysis and a creation of program that process data from a simple electronic nose. The program not only receives data, but it even saves them and process them for better clarity of results. Using this program it is possible to create a new database and identify an unknown sample if its data are already stored in database. The part of this work is an experiment to see if the created program is able to recognize some odors better then a human nose.
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Switching power supply for electron microscope
Jánešová, Daniela ; Szendiuch, Ivan (referee) ; Hejátková, Edita (advisor)
This thesis is about theory of switching power supplies and about a specific solution of switching power supply for electron microscope. In the beginning of the thesis are mentioned various solutions of part blocks of switching power supplies, their advanteges and disadvanteges, and their suitability for electron microscopy. In the next part of the thesis are described requirements and design scheme of switching power supply for scanning part of electron microscope. The thesis i also about technical solution and practical testing of the switching power supply and verification of its functions.
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Design of Reflow Soldering Station for Reballing of BGA Packages
Janiš, Adam ; Szendiuch, Ivan (referee) ; Otáhal, Alexandr (advisor)
This thesis deals with the design of a soldering oven for BGA reballing in a nitrogen protective atmosphere. The principles of reflow soldering, the advantages of a nitrogen protective atmosphere on the quality of solder joints and the types of soldering devices are described. The BGA packages´ part consists of their characteristics, assembling methods, a rework and repair process and solder joint inspection methods. Design of the device, as well as heat flow simulations, are included in the experimental part and particularly it also describes the used structural elements and the principle of function of the individual parts of the device. At the end of this work, the soldering process was measured and the ability of the sample soldering was verified.
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