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Lead Free Solder Joint Quality based on Heating Factor
Dosedla, Milan ; Zdeněk, Jurčík (referee) ; Starý, Jiří (advisor)
This bachelor’s thesis deals with influence of the heating factor on the quality of lead free solder joints in the reflow soldering process. It summarizes the basic knowledge and some requirements for soldered joints, analyses reflow profiles and presents some of the results published in the literature. Aim of the practical part is by samples soldered with different size of the heating factor determine and evaluate the impact of this factor to the strength and appearance of the final solder joint and the structure and thickness of the intermetallic layers.

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