Home > Search Results: keywords:"pájecí slitina"
Search:
 
Search Tips :: Simple Search
Search collections:
Sort by: Display results: Output format:
National Repository of Grey Literature 2 records found  Search took 0.00 seconds. 
Wetting Balance Method - Evaluation of PCB Material and Process Factors
 Chloupek, Tomáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work deals with issues of the wetting forces during soldering and evaluates material and procedural effects on the soldering process. The aim is to set the technology operations to get best quality of soldered joints.
Detailed record
Wetting Balance Method - Evaluation of PCB Material and Process Factors
 Chloupek, Tomáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work deals with issues of the wetting forces during soldering and evaluates material and procedural effects on the soldering process. The aim is to set the technology operations to get best quality of soldered joints.
Detailed record

Interested in being notified about new results for this query?
Subscribe to the RSS feed.
Digital Repository :: Search :: Submit :: Personalize :: Help
Powered by Invenio v1.1.2
Maintained by admin.invenio@techlib.cz
This site is also available in the following languages:
Česky  English