|
Experimentální měření J integrálu
Vavřík, Daniel ; Jandejsek, Ivan
Experimental measurement of the J integral on the thin planar specimen is presented. It is possible measure J integral directly as curve integral as it is defined. This approach is not as comfortable as standard measurement on CT specimen but is more appropriate for thin planar specimens.
|
| |
|
Určování aktuální polohy trhliny pomocí metody digitální obrazové korelace
Jandejsek, Ivan ; Vavřík, Daniel
This paper presents utilization of Digital Image Correlation and other image processing methods in determination of the actual position of the crack during the crack propagation in ductile material. This task is very important in fracture mechanics studies, especially in evaluation of full-field stress and strain in the vicinity of the crack. It encompasses detection of the crack faces, tracing of the crack tip and measuring the crack length.
|
| |
|
Rozvoj a aplikace digitální obrazové korelace
Jandejsek, Ivan
The presented work devotes to the methodology and related software development for Digital Image Correlation (DIC). DIC is used for experimental mechanics studies. It is the non-contact technique (Optical or X-Ray) that provides full-field and high resolution measurement of displacements and strains within an object subjected to loading.
|
| |
| |
|
Metoda interpolovaných elips založena na digitální obrazové korelaci
Vavřík, Daniel ; Jandejsek, Ivan
This paper presents the application of Digital Image Correlation (DIC) methodology for the measurement of strain fields using the Method of Interpolated Ellipses (MIE). It will be shown that MIE has the ability to measure strain fields with higher Signal to Noise Ratio in comparison with standard approaches of the strain field measurement. Consequently MIE is less sensitive on the measurement inaccuracy which is always present in real experiments.
|
| |
|
Digital Image Correlation
Jandejsek, Ivan ; Vavřík, Daniel
This paper presents the optical Digital Image Correlation method for in plane displacement field measurements. This method is based on tracing random structures, which are defined either by a sprayed pattern or by its own specimen surface structure. The displacements fields are obtained by measuring the mutual displacements of structure traced templates. The methodology for sub-pixel displacement measurements is presented.
|