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Wettability of PCB Surface Finishes and Comparison of Methods
Vídeňský, Ondřej ; Přikryl, Tomáš (referee) ; Starý, Jiří (advisor)
This bachelor´s thesis deals with testing methods for surface finishe´s wettability PCB. For this tests has been designed and created testing board which contains testing coupons for testing methods. Boards have been created and covered by surface finishes by Gatema Boskovice. In this thesis electroless nickel with immersion gold (ENIG) and immersion tin have been tested. For simulation of reflow soldering have been used test methods solder indicator, solder spread test and dewetting test. Wetting balance test method has been used as simulation of wave soldering.
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Temperature Profiles Measurement of SMD Packages
Strapko, Jaroslav ; Szendiuch, Ivan (referee) ; Starý, Jiří (advisor)
Diploma thesis mainly deals with temperature management and calculation of temperature profile in oven by using SMD packages (PLCC, 1206) of different thermal capacitance on testing PCB. Above all shows theoretical consecution of temperature profile calculation in oven by using known mathematical method like the lumped capacitance method or finite difference method. Theoretical solution and measured values are compared. Diploma thesis also deals with fixation methods of thermocouples K type on assembly, comparison methods based on known and subexperiment, determines the deficiencies of methods. This thesis can perform as theoretical as well as experimental resource to prediction of temperature profiles of PCB´s with different assembly density.
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Wave Soldering Fluxes Comparison
Stoklásek, Lukáš ; Martinec, Petr (referee) ; Starý, Jiří (advisor)
Semestral thesis introduces the problematics of wave soldering fluxes, flux residues and problems of electromigration. Practical part describes measuring of ionic contamination by using conductometric method, measuring the wettability by the wetting balance method and amount of failures on wave soldered printed circuit boards with these fluxes. The main object is to compare quality of the fluxes.
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Temperature Profiles Measurement of BGA Packages in Reflow Soldering
Tomčáková, Anna ; Bureš, Tomáš (referee) ; Starý, Jiří (advisor)
This graduation thesis addresses questions to thermal profile measurement of PBGA package during solder reflow process. The first part of thesis deals with problem of reflow process and reliability factors of solder joint connection. Next part analyses operation principles of thermocouples that are commonly used for temperature measurement. The experimental part deals with methods of thermocouples fixation during tests and measurements of dummy PBGA package. There was realized a method of dummy PBGA thermal profiles measurement and sample testing with and without simulated thermal load on PBGA package. The end of thesis concerns on possibilities of thermal profiles evaluation by using PWI method and thermal profile optimization of reflow process.
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Logistics and supply of PCB for repair of notebooks
Grob, Filip ; Starý, Jiří (referee) ; Špinka, Jiří (advisor)
This diploma thesis deals with issues of inventory management and logistics controlling. These segments are one of most important instruments used in logistics. Theory of these logistic instrumens are used as a base for practical part of this diploma thesis, where is described and suggested methodology for inventory management of printed circuit board in repair center. This buffer inventory serves for securing performance of customer’s supplies in case of failure on repair line. Thereinafter is realized program in MS Excel interface for supplying leadership with main insistence to prevent order delay.
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Production of Multilayer PCB
Janda, Ondřej ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This master thesis introduces the problematics of multilayer printed circuit boards. Theoretical part is focused on materials used for production of multilayer PCB and their parameters. At the same time, it focuses on the pressing process of multi-layered PCB, the types of presses used and their advantages and disadvantages. Practical part describes the methodology and testing of the PCB to identify the reliability of chosen electrical parameters. Testing is aimed to simulate thermal stress during machine soldering and during thermal stress in the target environment.
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PCBs Repairs with BGA and FC Packages
Buřival, Tomáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Graduation thesis is specialized on dilemma of the integrated circuits with ball grid array. Chapter two describes several types of packages and confrontation of their characteristics. Chapter three considers possibilities of corrections these boards bedded with packages, mounting and demounting of these packages, method of camera control and also inspection of the soldering process. Chapter four attend to practical measuring of thermal profiles and their optimalization.
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