Národní úložiště šedé literatury Nalezeno 2 záznamů.  Hledání trvalo 0.00 vteřin. 
Design of automated set-up intended for inspection of PMMA coated silicon wafers
Drozd, Michal ; Sobola, Dinara (oponent) ; Knápek, Alexandr (vedoucí práce)
During the coating the substrate with a thin layer of polymer resist several defects can to occur which could damage an exposure by electron beam lithography. The quality of the resist-coated surface prior to the exposure is also very important in terms of the final functionality of the fabricated micro device. The quality of the resist-coated surface can be measured by means of human visual inspection with a visible-light microscope. This bachelor's thesis is focused on the design and assembly of the automated set-up to do this inspection automatically. More precisely, the designed set-up is called WaferScan and it allows to scan a silicon wafer coated with a resist layer. The wafer surface is scanned with an optical camera and the taken images are analyzed using computer to determine the location and the size of the defects and the dust particles in the resist layer. The entire device consists of two moving axes, x and y, (that allow the movement of the camera) and a control electronic circuitry. Software to control the scanning device and the image processing tool were also developed.
Design of automated set-up intended for inspection of PMMA coated silicon wafers
Drozd, Michal ; Sobola, Dinara (oponent) ; Knápek, Alexandr (vedoucí práce)
During the coating the substrate with a thin layer of polymer resist several defects can to occur which could damage an exposure by electron beam lithography. The quality of the resist-coated surface prior to the exposure is also very important in terms of the final functionality of the fabricated micro device. The quality of the resist-coated surface can be measured by means of human visual inspection with a visible-light microscope. This bachelor's thesis is focused on the design and assembly of the automated set-up to do this inspection automatically. More precisely, the designed set-up is called WaferScan and it allows to scan a silicon wafer coated with a resist layer. The wafer surface is scanned with an optical camera and the taken images are analyzed using computer to determine the location and the size of the defects and the dust particles in the resist layer. The entire device consists of two moving axes, x and y, (that allow the movement of the camera) and a control electronic circuitry. Software to control the scanning device and the image processing tool were also developed.

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