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New Areas of the Ultrasonic Application in Microelectronics Technology
Buršík, Martin ; Pietriková, Alena (referee) ; Králová,, Iva (referee) ; Szendiuch, Ivan (advisor)
Doctoral thesis deals with the deposition of special thixotropic materials for microelectronic technology. The aim of the work is the development of the new method optimizing the dosing process in order to achieve a print resolution of better than 100 microns. The work includes the development of a special dispensing head (UZD) using the influence of ultrasonic energy. These results demonstrate the possibility of a newly developed method that is able to print thixotropic materials with a resolution of 65 microns. Compared to other methods achieves these results with the commonly used materials for thick film technology with particle size up to 5 microns.
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High Temperature Processes in Silicon Solar Cells Production
Frantík, Ondřej ; Hudec, Lubomír (referee) ; Banský,, Juraj (referee) ; Szendiuch, Ivan (advisor)
The thesis is focused on high temperature processes in crystalline solar cells production. Main topic is diffusion of traditional dopants phosphorus and boron. Diffusion processes for creating solar cells are different from classical diffusion in semiconductor industrial. It is reason why the thesis describes crated layers in detail. Knowledge of diffusion processes is used for creating bifacial solar cells and development of a new phosphorus emitter for conventional solar cells. Bifacial cells are a new type of cells. Developed new emitter increases efficiency and decreases cost of solar cells production. Another part the thesis is devoted to the prediction of diffusion processes. New models of phosphorus and boron diffusion for photovoltaic industrial are created in software SILVACO. Models correspond with real results.
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Harmonized FMEA analysis
Riabov, Mikhail ; Szendiuch, Ivan (referee) ; Novotný, Radovan (advisor)
The target of the diploma thesis on „Harmonized FMEA analysis“ is to familiarize with principles of quality planning and studying the theory of existing APQP tools. Another goal is to learn the basics of the new manual of harmonized FMEA analysis and discover some available SW tools for project support. This diploma thesis will be focused mainly on DFMEA analysis of traction assembly and the concept of changing to new harmonized version from VDA/AIAG will be explained. This concept meets the requirements for clear and comprehensible output required by the manufacturer, supplier, and customer. The diploma thesis is elaborated as a detailed clear guide for easier processing of FMEA according to the new manual.
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Investigation of Reliability for Solder Joints in Nitrogen Atmosphere
Šefara, Petr ; Otáhal, Alexandr (referee) ; Szendiuch, Ivan (advisor)
This thesis examines the inuence of nitrogen atmosphere on the quality of the solder joint lead-free solder paste. For the solder paste were measured and set temperature proles. Thesis includes the implementation and measurement of samples in a protective nitrogen atmosphere and without a protective atmosphere. These measurements are compared, and the conclusions were drawn for the inuence of nitrogen atmosphere. The reliability and the quality of the soldered joints were investigated.
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Emisivity and its Impact on the Heat Conductivity
Gančev, Jan ; Hejátková, Edita (referee) ; Szendiuch, Ivan (advisor)
This work deals with the issue of emissivity and its impact on the heat dissipation.The first part describes the basics of thermal management, the issue of emissivity and its measurement. In the second, experimental part, are dedicated the emissivity values of examined specimens. These values are then used as initial conditions for the thermal simulation. In the last part are compared the measured results and the simulated results and is evaluated the impact of emissivity for the heat dissipation.
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Temperature Profiles Measurement of SMD Packages
Strapko, Jaroslav ; Szendiuch, Ivan (referee) ; Starý, Jiří (advisor)
Diploma thesis mainly deals with temperature management and calculation of temperature profile in oven by using SMD packages (PLCC, 1206) of different thermal capacitance on testing PCB. Above all shows theoretical consecution of temperature profile calculation in oven by using known mathematical method like the lumped capacitance method or finite difference method. Theoretical solution and measured values are compared. Diploma thesis also deals with fixation methods of thermocouples K type on assembly, comparison methods based on known and subexperiment, determines the deficiencies of methods. This thesis can perform as theoretical as well as experimental resource to prediction of temperature profiles of PCB´s with different assembly density.
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Economic encapsulation for integrated circuits and modules
Kristek, Michal ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This Master´s thesis is about ways of packages of integration circuits and modules. Especially it´s about non-hermetic types of packages. One part of this paper are basic information about packaging and aspects in design of package. Next parts are design of test samples, which are package to epoxide powder material. Based on the results of the tests method, it will propose, where the technology will be used.
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Characteristic measuremens of thick-film RC elements with distributed parameters
Kořínková, Ksenia ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
The following work is focused on properties analysis of thick film RC elements with distributed parameters. The theoretical part offers projecting of RC elements, with their next realization. There are the following work parts: the resistance measurement and determination of the given resistances dependence scattering with different film number of the structures depending on their burning conditions. This bachelor's thesis is closed to the bachelor's work "Properties of Thick Film Multilayer Component".
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