National Repository of Grey Literature 2 records found  Search took 0.01 seconds. 
The via interconnection in LTCC
Sedliak, Erik ; Klíma, Martin (referee) ; Kosina, Petr (advisor)
This thesis deals with manufacturing process of LTCC 3D structures. Emphasis is placed mainly on the formation of via interconnections. In the second section of thesis, different via interconnections were designed, created and tested. Aim of this thesis was to evalute impact of via properties on vias function.
The via interconnection in LTCC
Sedliak, Erik ; Klíma, Martin (referee) ; Kosina, Petr (advisor)
This thesis deals with manufacturing process of LTCC 3D structures. Emphasis is placed mainly on the formation of via interconnections. In the second section of thesis, different via interconnections were designed, created and tested. Aim of this thesis was to evalute impact of via properties on vias function.

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