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Cooling effect on growth of intermetallic compounds in lead-free solder joints
Faldyna, Martin ; Novotný, Marek (referee) ; Vaško, Cyril (advisor)
This work deals with issues of process optimalization of lead-free soldering. The aim of this work is demonstrate of cooling on grow intermetallic layers during lead-free solde ring process and a hold intensity of cooling on joint quality. The experiment was performed with two types of solder pastes: Sn/Ag/Cu a Sn/Bi/Zn. The final samples were appraised in light of wet-ting, size of intermetallic layers, optical estimation solder and sudar stress test.

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