National Repository of Grey Literature 2 records found  Search took 0.01 seconds. 
SnBi Solder Paste and Influence of Reactive Nanoparticles
Rychlý, Ivo ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work deals with effects of nanoparticles, mainly copper and silver, on properities of lead-free solder pastes. It describes basic tests done on solder pastes according to IPC-TM-650 standards. In practical section this work focuses on the preparation of Sn-Bi solder paste and the measuring of viscosity. After that different concentrations of silver copper alloy nanoparticles are added to the SnBi solder paste. These solder pastes are tested by the IPC standarts and mechanical and resistive tests are done on printed circuit boards where the effects of mixed in nanoparticles are observed.
SnBi Solder Paste and Influence of Reactive Nanoparticles
Rychlý, Ivo ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work deals with effects of nanoparticles, mainly copper and silver, on properities of lead-free solder pastes. It describes basic tests done on solder pastes according to IPC-TM-650 standards. In practical section this work focuses on the preparation of Sn-Bi solder paste and the measuring of viscosity. After that different concentrations of silver copper alloy nanoparticles are added to the SnBi solder paste. These solder pastes are tested by the IPC standarts and mechanical and resistive tests are done on printed circuit boards where the effects of mixed in nanoparticles are observed.

Interested in being notified about new results for this query?
Subscribe to the RSS feed.