National Repository of Grey Literature 3 records found  Search took 0.00 seconds. 
Potting Compounds for Power Electronics
Štajner, David ; Červinka, Dalibor (referee) ; Vašíček, Adam (advisor)
Potting compounds are often used in electrotechnics to protect the electronics from the adverse effects, improves its insulating properties and helps to improve the heat transfer from the embedded devices in the surroundings. Embedding electronics into encapsulants extend the field of application. Such electronics can then be used in wet, dusty, corrosive or otherwise harsh environments.
The overview and the evaluation of the technical specifications of transparent materials for the production of composite wood panels
Holub, Jan ; Böhm, Martin (advisor) ; Arnetová, Karolína (referee)
Work includes: general introduction to the components of the wood-based panels with a transparent layer, the history of their production. It includes requirements for individual components of composite wood panels and requirements for wood and other wood-based materials, which serve as reinforcement. Also mentions claims potting material, which serves as a matrix. It includes a description of the technology of wood-based panels with a transparent layer. This paper introduces the most commonly used material serving as a matrix, their distinctive characteristics essential for the production of composite plates. Compares parameters resins based on polyester, polyurethane and epoxy resins and analyzes the choice of a suitable material for producing a composite board based on user requirements. Part of this work is to design materials for the manufacture of composite board with controlled light distribution.
Potting Compounds for Power Electronics
Štajner, David ; Červinka, Dalibor (referee) ; Vašíček, Adam (advisor)
Potting compounds are often used in electrotechnics to protect the electronics from the adverse effects, improves its insulating properties and helps to improve the heat transfer from the embedded devices in the surroundings. Embedding electronics into encapsulants extend the field of application. Such electronics can then be used in wet, dusty, corrosive or otherwise harsh environments.

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