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National Repository of Grey Literature 3 records found  Search took 0.01 seconds. 
Realization of hybrid integrated circuits leads for high-temperature applications
 Valíček, Jan ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
Bachelor thesis deals with realization possibilities of hybrid integrated circuit terminals for high temperature applications. It describes the realization method of direct mounting of terminals, this method of fixation using the conductive paste for the thick film technology. It also describes the selection of suitable materials and the temperature profile in the reflow and muffle furnace and follow removal of terminal oxides. Furthermore, a method for testing of terminals thermal resistance was realized. In conclusion, the method shows increased mechanical strength with the using of dielectric paste.
Detailed record
Optimization of the method of parallel gap spot welding of terminals on a thick film layer
 Hurtík, Pavel ; Skácel, Josef (referee) ; Otáhal, Alexandr (advisor)
This work deals with optimalization of interconnection between leads and thick film using spot welding. Technology of thick film ensures higher temperature range of thick film temperature sensors and other devices which could put them in the category of high temperature applications. Within this work will be designed and optimized suitable test motives and materials of thick film welding pads.
Detailed record
Realization of hybrid integrated circuits leads for high-temperature applications
 Valíček, Jan ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
Bachelor thesis deals with realization possibilities of hybrid integrated circuit terminals for high temperature applications. It describes the realization method of direct mounting of terminals, this method of fixation using the conductive paste for the thick film technology. It also describes the selection of suitable materials and the temperature profile in the reflow and muffle furnace and follow removal of terminal oxides. Furthermore, a method for testing of terminals thermal resistance was realized. In conclusion, the method shows increased mechanical strength with the using of dielectric paste.
Detailed record

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