|
|
Laboratory Double Layer PCBś Production
Martykán, Lukáš ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The content of this bachelor‘s thesis is laboratory production of two-layer printed circuit boards. It includes analysis of basic materials and types of boards in general. The main part focuses on the manufacture of printed circuit boards using the panel plating. In particular, theoretical analysis technology drilling, hole plating, photo resist processing and etching. The practical part is examining the impact speed of drill bit rotation during hole drilling, electroplating copper holes. Microsections are realised and evaluated.
|
|
|
Laboratory and Low Series Double Layer PCBś Production in PROTOCAD Laboratory
Chmela, Ondřej ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The content of this bachelor thesis is laboratory and low series production of double layer printed circuit boards. Thesis also includes theoretical analysis of materials and particular applications during their production. Main part focuses on PCB production using Panel plating method. Mainly on the analysis of the hole drilling technology Desmear, making holes conductive with Shadow technology, electrochemical plating of the holes and testing of the etching bath based on sulphuric acid. Practical part deals with preparation of sulfate etching bath, investigation of its durability a effectivity in laboratory conditions and low series operations. Furthermore, it tests technological steps of finishing, plating and making holes conductive. The results of these steps are then tested by microsections.
|
|
|
Laboratory Double Layer PCBś Production
Martykán, Lukáš ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The content of this bachelor‘s thesis is laboratory production of two-layer printed circuit boards. It includes analysis of basic materials and types of boards in general. The main part focuses on the manufacture of printed circuit boards using the panel plating. In particular, theoretical analysis technology drilling, hole plating, photo resist processing and etching. The practical part is examining the impact speed of drill bit rotation during hole drilling, electroplating copper holes. Microsections are realised and evaluated.
|
guest ::
