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Development of abrasion resistant concrete
Procházka, David ; Darebník, Zdeněk (referee) ; Hela, Rudolf (advisor)
The resistance of concrete to abrasion is an important feature particularly for transport and water management structures where the surface is exposed to abrasion. Bachelor thesis deals with individual influences on improvement of abrasion resistance of concrete surface. Furthermore, the search of test methods used for testing abroad. In the practical part, we assess the effect of curing agents on resistance to abrasion, water jet and tensile strength by tear-off test.
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Bismuth Low Temperature Solder Pastes
Hájka, Jan ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This bachelor thesis deals with low-temperature solder pastes with different bismuth content. It focuses on material, process and environmental influences that affect the reliability of the soldered joint. The practical part investigates the effect of isothermal aging and thermal cycling on the mechanical properties of solder joints formed by an eutectic tin-bismuth alloy. Furthermore, tin-bismuth solder pastes are compared to pastes with additives (TiO2 nanoparticles) and to SAC305 alloy. Technical adjustments are made to the measuring device in order to increase the accuracy of the measurement.
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Bismuth Low Temperature Solder Pastes
Vogel, Vojtěch ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This bachelor thesis deals with low-temperature soldering pastes with different bismuth content. It focuses on material, process and environmental influences that affect the reliability of the soldered joint. The effect of the elements on the eutectic solder alloy Sn-Bi58 is also described here. For the practical part two surface finishes (ENIG and immersion tin) and four solder pastes (PF743-PQ10, PF735-PQ10, PF734-PQ10, SAC305) are chosen. Tested PCBs are subjected to isothermal aging and cyclic temperature tests. Electrical resistance has changed during thermal aging.
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Bismuth Low Temperature Solder Pastes
Švéda, Miloš ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This master´s thesis deals with bismuth low temperature solder pastes. Describes the properties of bismuth solder pastes. It shows the process of manufacturing a printed circuit board for test. The thesis also characterizes laboratory temperature profile setting for the BiSn soldering pastes. Solder paste printing and placement 0 ohm rezistors to printed circuit boards with different surface finishes in the manufacturing plant. Setting of solder profiles for low soldering pastes in reflow oven. Testing resistence of mounted zero resistor on the test board at different aging temperature were analysed. Resistance measurement after a specified time. Testing of solder joint strenght of printed circuit boards for different surface treatments. Changes in structure wereanalysed on microsections for solder pastes.
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Development of abrasion-resistant concrete and testing methods
Procházka, David ; Bodnárová, Lenka (referee) ; Hela, Rudolf (advisor)
This diploma thesis deals with concrete abrasion resistance against abrasion. The constructions of transport and water management structures are most stressed by the action of abrasion by means of travel of vehicles and flowing water. Abrasion reduces the durability of the structures. The prerequisites for achieving the best possible abrasion resistance are examined. Furthermore, test methods that are currently used worldwide. The experimental part deals with the influence of individual types of aggregates amphibolite (Želešice), fecal gravel sand (Žabčice) and basalt (Bílčice) on abrasion resistance. Furthermore, the dependence between the strength of the concrete and the hardness of the surface for abrasion resistance. Abrasion resistance testing was determined by concrete abrasion, abrasion resistance by the Böhm method and by water jet.
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Components Testing in Automotive Industry
Tovaryš, Miroslav ; Svída, David (referee) ; Ramík, Pavel (advisor)
Tato bakalářská práce se zaměřuje na testování komponent v automobilovém průmyslu. Nabízí přehled testovacích metod, jejich základní popis a popis testovacích zařízení. V práci jsou také zmíněny CAD systémy, metoda konečných prvků a zrychlené testy, které slouží ke snižování finančních nákladů na testování pomocí omezování počtu testů nebo zkracování testovacích časů. Principy těchto nástrojů jsou zde stručně popsány. Závěr práce shrnuje důvody, které ženou vývoj testovacích metod kupředu.
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PCB s Cleaning from Prototypes to Low Series Production
Švéda, Miloš ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This bachelor thesis deals with the construction of the cleaning unit for prototype and low series production PCB cleaning. It describes the methods used for PCB cleaning, mainly for removing flux residues. It briefly describes the test methods for measuring contamination. It deals with the selection of individual components for cleaning equipment construction and compatible chemistry for flux residues cleaning.
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Bismuth Low Temperature Solder Pastes
Hájka, Jan ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This bachelor thesis deals with low-temperature solder pastes with different bismuth content. It focuses on material, process and environmental influences that affect the reliability of the soldered joint. The practical part investigates the effect of isothermal aging and thermal cycling on the mechanical properties of solder joints formed by an eutectic tin-bismuth alloy. Furthermore, tin-bismuth solder pastes are compared to pastes with additives (TiO2 nanoparticles) and to SAC305 alloy. Technical adjustments are made to the measuring device in order to increase the accuracy of the measurement.
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Bismuth Low Temperature Solder Pastes
Vogel, Vojtěch ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This bachelor thesis deals with low-temperature soldering pastes with different bismuth content. It focuses on material, process and environmental influences that affect the reliability of the soldered joint. The effect of the elements on the eutectic solder alloy Sn-Bi58 is also described here. For the practical part two surface finishes (ENIG and immersion tin) and four solder pastes (PF743-PQ10, PF735-PQ10, PF734-PQ10, SAC305) are chosen. Tested PCBs are subjected to isothermal aging and cyclic temperature tests. Electrical resistance has changed during thermal aging.
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