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Influence of printed board surface finishing on solderability with vapour soldering
Matras, Jan ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
Thesis deals with vapor soldering and wetting the surface with solder during the soldering process. It describes in detail the advantages and disadvantages of various surface finishes on the PCB. Generally characterizes the properties of lead-free solders and fluxes. Describes vapor soldering process, including the properties of the liquid itself. It also focuses on a method of evaluating the wettability by using solder balls and its performance on individual samples surface finishes.
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Immersion Tin Surface Finish of PCB
Karzel, Vítězslav ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The aim of this work is to study and more deeply understand everything about surface finishing of the printed circuit boards, that are used for lead-free soldering. Mainly we should focus on immersion tin and prepare some fundamental information for future measurement. Therefore, in the first part of the thesis is our main task is to create a~sufficient theoretical background for printed circuit boards, immersion tin and solderability. Then we are able to use previously created theoretical background to measure selected samples. Thereafter the measured data can be used for more strict evaluation, from which the results of measurement can be obtained.
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Surface Finishes of Copper in PCBś Production
Bedlek, Marek ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This work examines and compares properties of different types of surface finishes, their qualities and shortcomings and perspective for future use. Emphasis is placed on new product in the field of OSP, Glicoat F2 from SHIKOKU CHEMICALS CORPORATION and immersion tin. It evaluates their influence on solderability and its changes after several reflow cycles and isothermal aging.
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Immersion Tin Surface Finish of PCB
Karzel, Vítězslav ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The aim of this work is to study and more deeply understand everything about surface finishing of the printed circuit boards, that are used for lead-free soldering. Mainly we should focus on immersion tin and prepare some fundamental information for future measurement. Therefore, in the first part of the thesis is our main task is to create a~sufficient theoretical background for printed circuit boards, immersion tin and solderability. Then we are able to use previously created theoretical background to measure selected samples. Thereafter the measured data can be used for more strict evaluation, from which the results of measurement can be obtained.
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|
|
Influence of printed board surface finishing on solderability with vapour soldering
Matras, Jan ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
Thesis deals with vapor soldering and wetting the surface with solder during the soldering process. It describes in detail the advantages and disadvantages of various surface finishes on the PCB. Generally characterizes the properties of lead-free solders and fluxes. Describes vapor soldering process, including the properties of the liquid itself. It also focuses on a method of evaluating the wettability by using solder balls and its performance on individual samples surface finishes.
|
|
|
Surface Finishes of Copper in PCBś Production
Bedlek, Marek ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This work examines and compares properties of different types of surface finishes, their qualities and shortcomings and perspective for future use. Emphasis is placed on new product in the field of OSP, Glicoat F2 from SHIKOKU CHEMICALS CORPORATION and immersion tin. It evaluates their influence on solderability and its changes after several reflow cycles and isothermal aging.
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