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National Repository of Grey Literature 2 records found  Search took 0.00 seconds. 
Silver alloy wire-bonding
 Búran, Martin ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
This project deals with interconnection of semiconductor chips, especially interconnection using silver alloys. First part of this project contains interconnection methods and comparison of materials, which are used in wire bonding. Project include risk factors and the most frequent defects, which can appear during bonding. Next part contains testing proposals and testing of interconnected semiconductor chips.
Detailed record
Silver alloy wire-bonding
 Búran, Martin ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
This project deals with interconnection of semiconductor chips, especially interconnection using silver alloys. First part of this project contains interconnection methods and comparison of materials, which are used in wire bonding. Project include risk factors and the most frequent defects, which can appear during bonding. Next part contains testing proposals and testing of interconnected semiconductor chips.
Detailed record

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