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National Repository of Grey Literature 2 records found  Search took 0.00 seconds. 
Planar Circuits Elements on Low Temperature Cofired Ceramics
 Kosina, Petr ; Dřímal, Jiří (referee) ; Kolařík, Vladimír (referee) ; Šandera, Josef (advisor)
The present work deals with the design and manufacturing of 3D structures in LTCC (Low Temperatue Cofired Ceramics) technology. To use this technology LTCC workplaces have been designed and technological processes for high quality reproducible production were suggested. Technological possibilities of low temperature co-fired ceramics were demonstrated in the design and manufacturing of pressure sensors, electrode systems for ozone generators, planar circuit elements (coils and transformers) and in the design a special package for middle-power terahertz modulator. Design of selected parts of respective devices was proved by simulations in COMSOL Multiphysics. The work provides new insights into the structure of power integrated circuits sleeves and structure of electrode systems for different types of electrical discharges. Results of this work can contribute significantly in the application of planar circuit elements, in the development of different types of sensors, in the design of atypical types of packaging or in the design of electrode systems for capacitive coupled electrical discharges.
Detailed record
Planar Circuits Elements on Low Temperature Cofired Ceramics
 Kosina, Petr ; Dřímal, Jiří (referee) ; Kolařík, Vladimír (referee) ; Šandera, Josef (advisor)
The present work deals with the design and manufacturing of 3D structures in LTCC (Low Temperatue Cofired Ceramics) technology. To use this technology LTCC workplaces have been designed and technological processes for high quality reproducible production were suggested. Technological possibilities of low temperature co-fired ceramics were demonstrated in the design and manufacturing of pressure sensors, electrode systems for ozone generators, planar circuit elements (coils and transformers) and in the design a special package for middle-power terahertz modulator. Design of selected parts of respective devices was proved by simulations in COMSOL Multiphysics. The work provides new insights into the structure of power integrated circuits sleeves and structure of electrode systems for different types of electrical discharges. Results of this work can contribute significantly in the application of planar circuit elements, in the development of different types of sensors, in the design of atypical types of packaging or in the design of electrode systems for capacitive coupled electrical discharges.
Detailed record

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