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Mechanical Properties of solder joint
Meliš, Josef ; Starý, Jiří (referee) ; Stejskal, Petr (advisor)
This thesis deals with the differences between the mechanical properties of surface conditionings of the printed circuit boards and various types of soldering pastes. The practical part of the thesis describes all the steps necessary to conduct the experiment. The experiment will evaluate the measured mechanical strength of the solder joint for each surface conditioning, the types of solders, the increase in thickness of the intermetalic layer during long-term aging and the change in the structure of the solder joint.
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Application of Conductive Inks and Low Temperature Sintered Pastes in PCB Production
Kolek, Andrej ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The present masters's thesis informs about the development and application of low-temperature sintering pastes in the manufacture and assembly of PCB components of the enclosing lead-free using nanoparticles of metals and their compounds. Lead-free brazing technology which s using in the present time, which has its drawbacks, however, and thus gaining other appropriate alternatives that seek to replace or further refined lead brazing. The introduction of the theoretical part inform about retrieval method of the type, composition and properties of low-temperature sintering pastes consisting of metal nanoparticles and their compounds. This section describes and explains the reaction mechanisms taking place during the sintering process. The end of the first chapter is dedicated to nanotechnology and production of nanoparticles and their compounds for the needs of the low-temperature sintering and possible related problems. Folowing section is devoted to examples of practitioners of the application and use of low-temperature sintering pastes and tests with which to assess the characteristics and quality of the related sintering conection. At the end of the thesis is a summary perspective and the use of low-temperature sintering technology nanoparticle past into the future. The experimental part is devoted to the application of conductive ink on the base of graphite for the production of 1V, 2V and 4V structures and their electroplated by the copper. There were created technological processes of 2V and 4V structures and test proposed methodologies resistance conductive theme to environmental influences. Filling pasta was tested in implementing 4V structure. There were made microsections various technological applications and their results were processed and evaluated.
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Mechanical Properties of solder joint
Meliš, Josef ; Starý, Jiří (referee) ; Stejskal, Petr (advisor)
This thesis deals with the differences between the mechanical properties of surface conditionings of the printed circuit boards and various types of soldering pastes. The practical part of the thesis describes all the steps necessary to conduct the experiment. The experiment will evaluate the measured mechanical strength of the solder joint for each surface conditioning, the types of solders, the increase in thickness of the intermetalic layer during long-term aging and the change in the structure of the solder joint.
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Application of Conductive Inks and Low Temperature Sintered Pastes in PCB Production
Kolek, Andrej ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The present masters's thesis informs about the development and application of low-temperature sintering pastes in the manufacture and assembly of PCB components of the enclosing lead-free using nanoparticles of metals and their compounds. Lead-free brazing technology which s using in the present time, which has its drawbacks, however, and thus gaining other appropriate alternatives that seek to replace or further refined lead brazing. The introduction of the theoretical part inform about retrieval method of the type, composition and properties of low-temperature sintering pastes consisting of metal nanoparticles and their compounds. This section describes and explains the reaction mechanisms taking place during the sintering process. The end of the first chapter is dedicated to nanotechnology and production of nanoparticles and their compounds for the needs of the low-temperature sintering and possible related problems. Folowing section is devoted to examples of practitioners of the application and use of low-temperature sintering pastes and tests with which to assess the characteristics and quality of the related sintering conection. At the end of the thesis is a summary perspective and the use of low-temperature sintering technology nanoparticle past into the future. The experimental part is devoted to the application of conductive ink on the base of graphite for the production of 1V, 2V and 4V structures and their electroplated by the copper. There were created technological processes of 2V and 4V structures and test proposed methodologies resistance conductive theme to environmental influences. Filling pasta was tested in implementing 4V structure. There were made microsections various technological applications and their results were processed and evaluated.
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