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Realization of hybrid integrated circuits leads for high-temperature applications
Valíček, Jan ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
Bachelor thesis deals with realization possibilities of hybrid integrated circuit terminals for high temperature applications. It describes the realization method of direct mounting of terminals, this method of fixation using the conductive paste for the thick film technology. It also describes the selection of suitable materials and the temperature profile in the reflow and muffle furnace and follow removal of terminal oxides. Furthermore, a method for testing of terminals thermal resistance was realized. In conclusion, the method shows increased mechanical strength with the using of dielectric paste.
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Electrical properties of thick-film resistive pastes
Gajdoš, Jiří ; Buršík, Martin (referee) ; Řezníček, Michal (advisor)
This work deals with the technology of thick-film electronic circuits, describes the materials used for the implementation of a thick-film circuit and basic operations for their production. The content is also a proposal resistive pattern, which allows measurement of thick-film resistive inks. The practical part describes the creation of resistive pattern, creating measuring station, measurement of values of resistors, measurement temperature coefficient of resistance TCR and interpretation of evaluation.
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Electrical properties of thick film pastes measured in a wide temperature range
Gajdoš, Jiří ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
The aim of this master’s thesis is to investigate the electrical properties of various thick-film resistor pastes in a wider temperature range. The thesis mainly focuses on a change in electrical resistance depending on temperatures, which extend to the cryogenic region. To achieve this, there is an overview of the thick-film technology properties, major technological procedures, principles of resistive pastes conductivity, methods of electrical resistance measuring, possible errors in measurement and methods of their minimization. The content of this work is also familiar with the characteristics of a cryogenic station, on this foundation was proposed the measurement procedure and created thick-film circuits for this station. After measurement in the interval 10 K to 350 K, there are subsequently evaluated the data and explains the principles of the conductivity of used pastes.
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Mounting of leads by brazing on alumina substrate
Neradil, Petr ; Adámek, Martin (referee) ; Otáhal, Alexandr (advisor)
Bachelor´s thesis deals with the issue of implementation hybrid integrated circuit terminals for performance applications. It also states the advantages of each type of terminals and their technology. It discusses the materials used for brazing and describes problems of brazed in the electrical industry. The thesis also presents techniques for brazin of leads by brazers on the ceramic substrate. The conclusion contains the results of thermal and mechanical tests of the resulting connection.
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Monitoring the impact of ultrasonic energy to the leveling of thick film pastes
Pokluda, Tomáš ; Buršík, Martin (referee) ; Řezníček, Michal (advisor)
This bachelor thesis is focused on the problem of levelling of a profile by ultrasound after printing thick layer pastes and on electrical resistance and geometrical dimensions changes. It describes a creation of hybrid integrated circuits, thick film technology and the screen printing method. It also includes basics of fluid physics, basics of fluid rheology, and description of principles of the used ultrasound transducer. Records of the levelling measurements are presented through the use of photographs, comments, tables and graphs.
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Mounting of leads by brazing on alumina substrate
Neradil, Petr ; Adámek, Martin (referee) ; Otáhal, Alexandr (advisor)
Bachelor´s thesis deals with the issue of implementation hybrid integrated circuit terminals for performance applications. It also states the advantages of each type of terminals and their technology. It discusses the materials used for brazing and describes problems of brazed in the electrical industry. The thesis also presents techniques for brazin of leads by brazers on the ceramic substrate. The conclusion contains the results of thermal and mechanical tests of the resulting connection.
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|
|
Electrical properties of thick-film resistive pastes
Gajdoš, Jiří ; Buršík, Martin (referee) ; Řezníček, Michal (advisor)
This work deals with the technology of thick-film electronic circuits, describes the materials used for the implementation of a thick-film circuit and basic operations for their production. The content is also a proposal resistive pattern, which allows measurement of thick-film resistive inks. The practical part describes the creation of resistive pattern, creating measuring station, measurement of values of resistors, measurement temperature coefficient of resistance TCR and interpretation of evaluation.
|
|
|
Electrical properties of thick film pastes measured in a wide temperature range
Gajdoš, Jiří ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
The aim of this master’s thesis is to investigate the electrical properties of various thick-film resistor pastes in a wider temperature range. The thesis mainly focuses on a change in electrical resistance depending on temperatures, which extend to the cryogenic region. To achieve this, there is an overview of the thick-film technology properties, major technological procedures, principles of resistive pastes conductivity, methods of electrical resistance measuring, possible errors in measurement and methods of their minimization. The content of this work is also familiar with the characteristics of a cryogenic station, on this foundation was proposed the measurement procedure and created thick-film circuits for this station. After measurement in the interval 10 K to 350 K, there are subsequently evaluated the data and explains the principles of the conductivity of used pastes.
|
|
|
Realization of hybrid integrated circuits leads for high-temperature applications
Valíček, Jan ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
Bachelor thesis deals with realization possibilities of hybrid integrated circuit terminals for high temperature applications. It describes the realization method of direct mounting of terminals, this method of fixation using the conductive paste for the thick film technology. It also describes the selection of suitable materials and the temperature profile in the reflow and muffle furnace and follow removal of terminal oxides. Furthermore, a method for testing of terminals thermal resistance was realized. In conclusion, the method shows increased mechanical strength with the using of dielectric paste.
|
|
|
Monitoring the impact of ultrasonic energy to the leveling of thick film pastes
Pokluda, Tomáš ; Buršík, Martin (referee) ; Řezníček, Michal (advisor)
This bachelor thesis is focused on the problem of levelling of a profile by ultrasound after printing thick layer pastes and on electrical resistance and geometrical dimensions changes. It describes a creation of hybrid integrated circuits, thick film technology and the screen printing method. It also includes basics of fluid physics, basics of fluid rheology, and description of principles of the used ultrasound transducer. Records of the levelling measurements are presented through the use of photographs, comments, tables and graphs.
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