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National Repository of Grey Literature 2 records found  Search took 0.00 seconds. 
Analysis of Defects on PCB Using X-RAY
 Mlýnek, Martin ; Vala, Radek (referee) ; Řihák, Pavel (advisor)
This thesis is focused on BGA packages and fault detection after rework using X – Ray. There is a description of BGA packages by carrier substrate, techniques of connecting on chip, from mounting packages to repair printed circuit boards (hereafter PCB). Thesis summarizes description of defects, which are created after rework process. There is also description of X – Ray as method for analyzing defects. X – PLANE method used to detect internal structure of BGA packages and it was confirmed by microsection and by software for reconstruction. Description of automatic and manual measurement is follow.
Detailed record
Analysis of Defects on PCB Using X-RAY
 Mlýnek, Martin ; Vala, Radek (referee) ; Řihák, Pavel (advisor)
This thesis is focused on BGA packages and fault detection after rework using X – Ray. There is a description of BGA packages by carrier substrate, techniques of connecting on chip, from mounting packages to repair printed circuit boards (hereafter PCB). Thesis summarizes description of defects, which are created after rework process. There is also description of X – Ray as method for analyzing defects. X – PLANE method used to detect internal structure of BGA packages and it was confirmed by microsection and by software for reconstruction. Description of automatic and manual measurement is follow.
Detailed record

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