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Modelling of microelectronic structures properties
Luňáček, Erik ; Řezníček, Michal (referee) ; Vaško, Cyril (advisor)
This work is focused on thermomechanical and electric analyses of microelectronic structures in the ANSYS program. Firstly an analysed model was formed in the program Solidworks. Then structures with components SOT23, SMD 1206, FlipChip and chip with wire bonding interconnection were analyzed. The analyses were performed for the temperatures 50, 100, 150 °C and various materials. The simulations outputs are presented as pictures in colours with models deformations and calculated values. The results will be utilised in education and presented on the web. The Flash, ActionScript and XML technologies were used for application to present results of the research.
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Modelling of microelectronic structures properties
Luňáček, Erik ; Řezníček, Michal (referee) ; Vaško, Cyril (advisor)
This work is focused on thermomechanical and electric analyses of microelectronic structures in the ANSYS program. Firstly an analysed model was formed in the program Solidworks. Then structures with components SOT23, SMD 1206, FlipChip and chip with wire bonding interconnection were analyzed. The analyses were performed for the temperatures 50, 100, 150 °C and various materials. The simulations outputs are presented as pictures in colours with models deformations and calculated values. The results will be utilised in education and presented on the web. The Flash, ActionScript and XML technologies were used for application to present results of the research.
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Tepelné chování vybraných pískovců z českých lokalit
Plevová, Eva
Selected Czech sandstone samples were determined by thermogravimetry (TG), differential thermal analysis (DTA) and FT- IR spectroscopy (FT-IR). These methods were used for determination of mineral composition in Czech sandstone samples. The texture and spatial orientation was determined by optical microscopy. Obtained data were confronted with data from thermomechanical analysis (TMA).
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