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National Repository of Grey Literature 2 records found  Search took 0.00 seconds. 
Design of bonding system for PCB repairs
 Burian, Jaroslav ; Skácel, Josef (referee) ; Otáhal, Alexandr (advisor)
The goal of this thesis is to design a device for PCB repairing, mainly for conductive traces and soldering pads. The design focuses on mechanical construction, control unit and controling of the whole device, which is semiautomatic. A great deal of emphasis is placed on the simplicity and versality of the construction. The teoretic part of this thesis is addressed to the printed circuit board and its repairs. There are presented existing devices for repairing of those defects in the second part. The next part is focused on the design itself in terms of mechanical construction and choosing electrical components. There is described controlling of these components. Part of making mechanical components follows. Last but not least, firmware, which controls whole machine is described there. Finally, the machine was tested in the repair process of the solder pad on the printed circuit board.
Detailed record
Design of bonding system for PCB repairs
 Burian, Jaroslav ; Skácel, Josef (referee) ; Otáhal, Alexandr (advisor)
The goal of this thesis is to design a device for PCB repairing, mainly for conductive traces and soldering pads. The design focuses on mechanical construction, control unit and controling of the whole device, which is semiautomatic. A great deal of emphasis is placed on the simplicity and versality of the construction. The teoretic part of this thesis is addressed to the printed circuit board and its repairs. There are presented existing devices for repairing of those defects in the second part. The next part is focused on the design itself in terms of mechanical construction and choosing electrical components. There is described controlling of these components. Part of making mechanical components follows. Last but not least, firmware, which controls whole machine is described there. Finally, the machine was tested in the repair process of the solder pad on the printed circuit board.
Detailed record

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