National Repository of Grey Literature 7 records found  Search took 0.00 seconds. 
Using Computer Aided Engineering for analysis of the ESEM differential chamber
Čech, Vojtěch ; Polsterová, Helena (referee) ; Maxa, Jiří (advisor)
The semestral project will focus on using Computer Aided Engineering for analysis of the ESEM differential chamber. The instruments used for the analysis, evaluation and scrutiny of the given issue will be the CAD and CAE systems (Computer Aided Design and Computer Aided Engineering).
Analysis of the distribution of the temperature profile in the furnace brazing using CAE systems
Stručovský, Aleš ; Vyroubal, Petr (referee) ; Maxa, Jiří (advisor)
The aim of this project is using the CAE system to analyze the distribution of the temperature profile brazing furnace DIMA 0180. To create the model is used SolidWorks Premium 2012. The simulation is performed using the Flow Simulation. This work builds on the knowledge diploma thesis by Martin Procházka titled The effect of different heat capacities and components on the longitudinal temperature profile for reflow soldering. We start from the knowledge of heat transfer, especially of heat conduction and radiation, which appear in the furnace.
Using Computer Aided Engineering for analyse the detector
Vyroubal, Petr ; Polsterová, Helena (referee) ; Maxa, Jiří (advisor)
This master's thesis deals with influence of the shape comparison of convergent and Laval nozzles in the secondary electron detector shutters to the resulting pressure and gas flow in the secondary electron detector for environmental scaning electron mictoscope. To the detector analysis are used Computer Aided Engineering systems CAD and CAE, SolidWorks and SolidWorks Flow Simulation.
Analysis of the distribution of the temperature profile in the furnace brazing using CAE systems
Stručovský, Aleš ; Vyroubal, Petr (referee) ; Maxa, Jiří (advisor)
The aim of this project is using the CAE system to analyze the distribution of the temperature profile brazing furnace DIMA 0180. To create the model is used SolidWorks Premium 2012. The simulation is performed using the Flow Simulation. This work builds on the knowledge diploma thesis by Martin Procházka titled The effect of different heat capacities and components on the longitudinal temperature profile for reflow soldering. We start from the knowledge of heat transfer, especially of heat conduction and radiation, which appear in the furnace.
Using Computer Aided Engineering for analysis of the ESEM differential chamber
Čech, Vojtěch ; Polsterová, Helena (referee) ; Maxa, Jiří (advisor)
The semestral project will focus on using Computer Aided Engineering for analysis of the ESEM differential chamber. The instruments used for the analysis, evaluation and scrutiny of the given issue will be the CAD and CAE systems (Computer Aided Design and Computer Aided Engineering).
Using Computer Aided Engineering for analyse the detector
Vyroubal, Petr ; Polsterová, Helena (referee) ; Maxa, Jiří (advisor)
This master's thesis deals with influence of the shape comparison of convergent and Laval nozzles in the secondary electron detector shutters to the resulting pressure and gas flow in the secondary electron detector for environmental scaning electron mictoscope. To the detector analysis are used Computer Aided Engineering systems CAD and CAE, SolidWorks and SolidWorks Flow Simulation.
Sborník 19. Mezinárodní konference o uživatelsky programovatelných logických obvodech a jejich aplikacích (FPL)
Daněk, Martin ; Kadlec, Jiří ; Nelson, B.
The International Conference on Field Programmable Logic and Applications (FPL) is the first and largest conference covering the rapidly growing area of field-programmable logic. During the past 18 years, many of the advances achieved in reconfigurable architectures, applications, design methods and tools have been first published in the proceedings of the FPL conference series. Its objective is to bring together researchers and industry from all over the world for a wide ranging discussion of FPGAs, including, but not limited to: applications, advanced electronic design automation (EDA), novel system architectures, embedded processors, arithmetic, dynamic reconfiguration, etc. FPL is attended by top-level scientists and researchers. The 19th FPL continues the tradition of the previous editions. FPL2009 was hosted by UTIA AV CR in cooperation with a number of Czech FPGA research groups.

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