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The design of electrochemical sensor with integrated potentiostat chip
Uhlár, Martin ; Novotný, Marek (referee) ; Adámek, Martin (advisor)
The research on electrochemical sensor applications in combination with application-defined electronic circuits is a very fast developing field of modern sensorics. Device designing of unique integrated systems with specific properties and parameters is now becoming the everyday practice for producers of devices based on the latest technology progress in microelectronics. In the process of realization of a new device type, the main objective consists in increasing the possibility of detecting very low concentrations of heavy metals in the given chemical solution, extending the signal-to-noise ratio, and measuring the potential of a sensor. The general aim of this Master’s thesis is to design the topology of a sensor based on the thick film technology, to materialize the sensor, and to make experimental measurement using the sensor prototype. The practical reason for basing the measurement on the application of this thick film sensor is to find out whether the operational integration of the sensor and the circuit has been achieved according to the original hypothesis. Importantly, it is also necessary to determine whether the reproducibility of measured results has been reached. The innovative aspect of the created device consists in the improvement of output characteristics given by the integration of ASIC (IMAM CHIP). The integration of ASIC on the surface of the sensor eliminates the huge parasitic influence that affects the accuracy of measurement.
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Semiconductor chip interconnection
Mareš, Petr ; Vaško, Cyril (referee) ; Novotný, Marek (advisor)
The Bachelor Thesis deals with contacting semiconductor chips using wirebonding. Opening chapters devoted to technology interconnect chips with the enviroment and materials to use. Much of this work is devoted to simulation wirebonding connections in Ansys. The simulations are engaged in examining thermomechanical stress in wires and current density at contacts.Results carried out simulations are measured with a focus on reliability and stressability of individual wirebonding connections. Part of this work is also practical measurements current stressability of wirebonding connections. At the end of the work was examined how to change the current stressability wires after the application of glue on contact.
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Uncertainty of Indirect Measurement Determined by Monte Carlo Method
Novotný, Marek ; Havlíková, Marie (referee) ; Šedivá, Soňa (advisor)
This bachelor's thesis deals with determination of uncertainty in measurement, primarily with regard to the indirect measurement. There is theoretically analyzed and practically implemented calculate the uncertainty coefficient ent - speed multiple hole probe Annubar 485 in two ways. The first way is to calculate the uncertainty of the classical met-hod and the second one is the uncertainty using the Monte Carlo.
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Reduction of Contact Pairs Friction Losses
Novotný, Marek ; Raffai, Peter (referee) ; Maršálek, Ondřej (advisor)
This bachelor thesis deals with the topic of mechanical efficiency of contact pairs in the crankshaft of the combustion engine. The introductory section focuses on the efficiency of the combustion engine as a whole. In addition, it describes the areas where mechanical losses primarily occur. The following chapters describe mechanism of friction losses, the main factors affecting their amount and the most modern ways to increase mechanical efficiency. In the closing chapter, some basic computing relations, describing the size of mechanical losses are listed. The aim of this thesis is to acquaint the reader with the importance of mechanical efficiency in the area of combustion engines.
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Cooling effect on growth of intermetallic compounds in lead-free solder joints
Faldyna, Martin ; Novotný, Marek (referee) ; Vaško, Cyril (advisor)
This work deals with issues of process optimalization of lead-free soldering. The aim of this work is demonstrate of cooling on grow intermetallic layers during lead-free solde ring process and a hold intensity of cooling on joint quality. The experiment was performed with two types of solder pastes: Sn/Ag/Cu a Sn/Bi/Zn. The final samples were appraised in light of wet-ting, size of intermetallic layers, optical estimation solder and sudar stress test.
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Programs for calculating measurement uncertainty using Monte Carlo method
Novotný, Marek ; Havlíková, Marie (referee) ; Šedivá, Soňa (advisor)
The thesis deals with establishing uncertainties of indirect measurements. It focuses primarily on random number generators in software enabling the calculation of mea-surement uncertainties using Monte Carlo. Then it focuses on the uncertainty calculati-on indirect measurement as the Monte Carlo method and the classical numerical met-hod. The practical part deals with the verification of randomness generators numbers contained in various softwares. It also deals with the determination of uncertainties indi-rect current measurements by both above-mentioned methods and then comparing and evaluating the values achieved.
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Virtual laboratory modul development
Volf, Lukáš ; Novotný, Marek (referee) ; Vaško, Cyril (advisor)
Virtual laboratory is project aimed at creation of modern teaching instrument, which should help to students of microelectronics, but not only them, to understand questions of surface mount technology and packaging in electrotechnics. This work deals with analysis one of substantial part of the project, which is creation of interactive animations helping to understand questions of a given problems. In this work are described partial technological processes and their sequential application into interactive multimedia format.
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Using Computer Aided Engineering for analyse the detector
Novotný, Marek ; Špinka, Jiří (referee) ; Maxa, Jiří (advisor)
This diploma thesis deals with electron microscopy. Examined equipment is environmental scanning electron microscope (ESEM), namely scintillation a detector of the microscope. There is solved the influence of the profile of holes in diaphragms to the resulting pressure and gas flow on the path of secondary electrons at the detector. Introductory part of thesis informs about microscopy in general, with concentration on electron microscopy; especially on scanning microscope, because research is taken just on the environmental scanning electron microscope. Another part informs about both general principles of dynamics of gases and with finite volume method. Another part deals with concrete used software and with setting of individual parameters for calculation. At the beginning of calculation are used five basic profiles of holes in diaphragms for pressure 1000 Pa in the chamber of the sample. For modelling individual shapes is used 3D parametric modeller SolidWorks. Analysis of circulation of secondary electrons through detector is made by using Cosmos FloWorks module. The most suitable type of diaphragms is chosen from measured models. Another part of diploma thesis deals with measuring of chosen types of diaphragms for more pressures in the chamber of the sample; the pressure is 200, 400, 600, 800 and 1000 Pa. The outcomes of this research are both models of pressure and speed of circulation inside the detector and graphically processed values by using different diaphragms, respectively one type of a diaphragm in different pressures. Production drawings of each diaphragm, together with calculated models, are enclosed.
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Modern methods for Chip Attach
Nešpor, Dušan ; Novotný, Marek (referee) ; Szendiuch, Ivan (advisor)
The work deals with packaging and die attach issues. The general aim of this investigation is thermomechanical stress between package and substrate depending on different thermal and mechanical properties of used materials. Work contains modeling with program ANSYS and practical tests with testing packages. Determining a place in the solder with the maximal and the minimal stress values and determining of the stress distribution for all materials are the results of this research.
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