|
|
Reactive Nanoparticles Application to SAC 305 Solder Paste
Matras, Jan ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work is a research on the topic of reactive nanoparticles and their agitation into the solder paste, which it also describes. It describes in detail the properties of each solder alloys. It explains the creation of intermetallic layers in the soldering process and examines their structure. It also focuses on the evaluation and methodology of testing the properties of solder pastes. In the practical part, individual tests are performed with PF606 and PF610 solder paste.
|
|
|
Wetting and Spreading of Solder on PCB Surface
Wiesner, Lukáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work deals with the metal surface wetting problems of molten lead-free solder and monitoring of ongoing processes at the inter-phase interface. This work also deals with flushing monitoring of spreading velocity on solder finishes Ni/Au and Immersion Sn deposited on copper plated base material FR4 using digital cameras. Measurement is performed at the improved workplace. After the reflow process is measured by length of spreading solder. It evaluates and compares the time dependence of velocity of spreading solder for Ni/Au and Immersion Sn finishes.
|
|
|
Mapinng and improving logistic flow in the firm ZEBR.
Kmeť, Lenka ; Vyroubal, Petr (referee) ; Špinka, Jiří (advisor)
The aim of the project is to chart the course of logistics and information flows of the selected company, to eveluate the entire process and to find improvements. In the first part there is mentioned an introduction into methods of lean manufacturing, value stream mapping and throughput time calculations. In the next section the flow of values is mapped and the map of current state is created. Futhermore, the throughput time of selected parts is computed and the mounting diagram of measured products is assembled. On to these materials are founded the sources of wasting and solutions are suggested. Afterwards on the basis of the obtained data are given solutions eveulated in terms of economic indicators.
|
|
|
Solder Joint Quality based on Heating Factor
Kučírek, Martin ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Master’s thesis in the theoretical part analyses the heating factor (Q), which has significant share on quality of a solder joint. The practical part describes the design and production of test PCB and setting temperature profiles, SMD resistors soldering by using BiSn solder paste. Shear tests of SMD solder joints were realised and evaluated including isothermal ageing samples. At the end of master’s thesis solder joints visual aspects and defects were evaluated, measurement thickness of intermetallic compound by not only optical microscope but also SEM, discussion about results and Q was evaluated.
|
|
|
Reliability of LED Panels Solder Joints
Šimon, Vojtěch ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Thesis is focused on the effect of heating factor on quality of solder joints. In theoretical part is solved reflow soldering technology, problematice of solder paste choice or criteria of soldering profile setting. The practical part is dedicated to demonstrating the impact of heating factor on solder joint quality. There are used X-Ray analysis, microsections and electron microscopy. In the final part of this thesis are summarized knowledge from theoretical part and experimental obtained results to defend of next steps in diploma thesis.
|
|
|
Diagnosis of high voltage capacitors for cascade voltage multiplier
Baev, Dmitriy ; Špinka, Jiří (referee) ; Krbal, Michal (advisor)
The main subject of the final thesis is to find a suitable method for measuring the partial discharge (PD) in the dielectric of high-voltage capacitor. In the theoretical part of my thesis contains from the mechanisms of origin and the harmful effects of partial discharge at high voltage insulation of capacitor. It describes the global galvanic method of partial discharge measurement, the principle of cascade voltage multiplier, its main components are high-voltage capacitor and diode, facilities quality measurement of capacitors for voltage multipliers, advantages and disadvantages and principles of HIPOTRONICS DDX-8003 with the pulse discrimination system. In the experimental part of the diploma thesis is familiar with the diagnostics of high – voltage capacitors by means of laboratory measurements on the electronic bridge and with the help of partial discharge measurement system. Design of suitable electrode arrangement is described which eliminates the influence of corona which makes it impossible to measure partial discharges and the dissipation factor (tg ). Analysis data from measurement and determination of quality level, eventual degradation of measured capacitors. The result of this project should be designed the methodology for finding of poor – quality capacitors in order to increase the reliability of the voltage multiplier.
|
|
| |
|
| |
|
|
REBALLING OF BGA PACKAGES USING PACE TF2700 EQUIPMENT
Roháček, Peter ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The Diploma thesis is focused on reballing of BGA packages with the device PACE TF 2700. It describes the general types of BGA packages, their defects, importance of thermal management to the solder techniques, where it is also talked about the meaning of solders and fluxes for the joint. The work informs about the most common methods of reballing, the proper handling of components and the current situation with BGA stencils on the market. It briefly describes the device operation of PACE TF 2700, that is working on the convection and IR principle of heating components. It deals with the manufacturing of the template, dummy BGA packages, the test plates, creation of the thermo profile, comparing and examining the defects and their causes, which had the most significant impact on the results. The achievements would serve for comparing them with the results of the future laboratory exercises or as a subject for further works.
|
|
|
Lead-Free Voids Cause Mechanisms and Influence on Reliability
Šimon, Vojtěch ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The aim of this work is to analyze reliability of lead-free solder join, in particular the voids generated during the soldering process. The main target of the theoretical part of the work is to isolate basic mechanisms of formation of the voids and optimize the soldering process. The practical part of the paper is based on monitoring the count and size of the voids in a solder join. An X-Ray tomograph has been chosen as a non-destructive method of detection. The statistical part of this work compares conventional soldering of the entire board with local soldering by IR radiation.
|
guest ::
